News
FRANKLIN, MA -- Speedline Technologies will tackle the SMT industry's most pressing manufacturing challenges in a new
series of free, monthly webinars.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
WASHINGTON -- The U.S. Congress, led by Senators John Ensign (R-NV) and Joe Lieberman (D-CT),
yesterday unveiled a proposal calling for a boost in R&D funding for basic
and advanced science, in an effort to spearhead nationwide attention toward developing
domestic engineering talent and ideas.
In a letter to colleagues, the senators said the bill “aims to make the necessary improvements in research, education of science and technology talent and innovation infrastructure to allow the United States to maintain the global leadership it achieved in the last century.” The bill responds to the recommendations made in the National Innovation Initiative report, “Innovate America,” issued late last year by the Council on Competitiveness.
In a letter to colleagues, the senators said the bill “aims to make the necessary improvements in research, education of science and technology talent and innovation infrastructure to allow the United States to maintain the global leadership it achieved in the last century.” The bill responds to the recommendations made in the National Innovation Initiative report, “Innovate America,” issued late last year by the Council on Competitiveness.
ELK GROVE VILLAGE, IL -- SigmaTron International today reported revenues 41.3% to $34.9 million yet earnings fell 7.6% to $1.2 million for its second quarter ended Oct. 31.
A year ago the an
electronics manufacturing services company reported net revenues of $24.7 million
and net income of $1.3
million.
Press Releases
- Libra Industries Expands Precision Fabrication Capabilities in Guaymas with Advanced Amada Laser System
- Distron Adds Second Juki Selective Soldering System to Support Growing Production Demand
- Amtech’s New Process Upgrades Elevate Transparency, Speed, and Manufacturing Readiness
- FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot