News
Jersey City, NJ – Cookson Electronics Assembly Materials’ ALPHA Vaculoy SACX lead-free wave solder alloy has been approved for use by LG Electronics DS Division (CD-ROM).
Gerry Campbell, a Cookson global product manager, noted that “As leading OEM companies such as LG continue to drive the reduction in the total cost of their lead-free assemblies, we see a continuation of the trend of customers moving away from SAC305 to SACX.”
Gerry Campbell, a Cookson global product manager, noted that “As leading OEM companies such as LG continue to drive the reduction in the total cost of their lead-free assemblies, we see a continuation of the trend of customers moving away from SAC305 to SACX.”
ANGLETON, TX – Benchmark Electronics, a top EMS firm, expects revenues and earnings per share to exceed the high end of guidance for its fiscal second quarter.
The company in April guided for quarterly revenue of $630 million to $660 million.
The company is finalizing its financial closing for the second quarter ended June 30. Results for the second quarter will be announced July 20.
The company is finalizing its financial closing for the second quarter ended June 30. Results for the second quarter will be announced July 20.
SAN FRANCISCO – Makers of semiconductor production equipment and materials can look forward to the market for their wares growing 19% sequentially this year and 10% next year to reach $40 billion, the highest level since 2000.
The forecast was disclosed this week at the SemiCon West trade show by Strategic Marketing Associates. According to SMA president George Burns, the double-digit growth for this year and next is being fueled by rising levels of new wafer fab construction that began in 2004 and is expected to crest in 2007. “We see the industry bringing 35 new fabs online by end of 2007 with a total equivalent capacity, when fully ramped, of more than 2 million 200mm diameter wafers per month. Representing more than 15 acres of silicon, this monthly output is roughly equal to 18% of industry's theoretical full capacity today.”
The forecast was disclosed this week at the SemiCon West trade show by Strategic Marketing Associates. According to SMA president George Burns, the double-digit growth for this year and next is being fueled by rising levels of new wafer fab construction that began in 2004 and is expected to crest in 2007. “We see the industry bringing 35 new fabs online by end of 2007 with a total equivalent capacity, when fully ramped, of more than 2 million 200mm diameter wafers per month. Representing more than 15 acres of silicon, this monthly output is roughly equal to 18% of industry's theoretical full capacity today.”
Press Releases
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- Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan
- AIM Solder Announces New Distribution Partnership with Covermat Co., Ltd. in Thailand
- Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers