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Jersey City, NJ  – Cookson Electronics Assembly Materials has established a Global Applications Technology and Engineering group, which will join its global R&D group. The new group’s mission is to help customers solve assembly technology, yield and reliability challenges by understanding process dynamics, and incorporating internal testing and validation capabilities.
 
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing,” said Steve Brown, director of global applications technology. “This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as Pb-free production becomes a daily reality. At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection. This enables us to re-create and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs."
 
HERNDON, VA — The International Electronics Manufacturing Initiative (iNEMI) is launching a new project to develop testing and use condition guidelines for electronic components used in medical applications. The Medical Components Reliability Specifications Project is the first organized under the consortium’s new Medical TIG (Technology Integration Group).
 
The project will develop test and extrapolation methodologies to predict reliability of components in actual use. The project team plans to create a minimum set of requirements for electronic components used in implanted or life-critical devices. The project will also suggest when testing should be done, what kind of testing is required and how to apply test results.

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ST. LOUIS -- LaBarge has been named sole supplier for PCBs by ZTEC Instruments, and received initial orders valued at approximately $1.6 million.
 
LaBarge is producing PCBs for the oscilloscopes, waveform generators and digitizers that constitute ZTEC's modular instrument platform. The platform is used to monitor systems in the telecommunications, military, medical and industrial markets. It integrates several automated test and measurement instruments into a single box.
 
LaBarge is manufacturing the PCBs at its Pittsburgh facility. Production on the initial orders is expected to continue through December 2006, with additional orders anticipated.

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