News
LOUISVILLE, KY -- Sypris Solutions today reported revenue fell 10.5% to $126 million for its third quarter compared to a year ago. The company reported a net loss of $800,000, down from a profit of $3 million. Most of the problems stemmed from the company's industrial and electronics groups.
Electronics' sales fell on a launch delay of a new classified program for the U.S. Government. That program is now expected to reach full ramp in 2007, said Jeffrey T. Gill, president and chief executive.
Electronics' sales fell on a launch delay of a new classified program for the U.S. Government. That program is now expected to reach full ramp in 2007, said Jeffrey T. Gill, president and chief executive.
JACKSON, MI -- Electronics manufacturing services provider Sparton Corp. reported first quarter 2007 sales rose 29% to $48.3 million but the net loss widened 92% to $2.5 million versus last year.
Sales were stronger in all segments except government, which declined significantly due to several unsuccessful sonobuoy drop tests. The failed tests incurred higher program costs and resulted in lost contracts, Sparton said.
LAKE TAHOE, CA – The ESD Association seeks abstracts for the International Electrostatic Discharge Workshop next May in California.
The workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits, advanced semiconductor system on chip, and system in package applications. This event is closely aligned with the association’s EOS/ESD Symposium.
Presentation proposals are sought on novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, ESD testing, ESD characterization, system level ESD issues, or unresolved issues.
The workshop takes place May 14-17, at the Stanford (CA) Sierra Conference Center. Abstracts are due Nov. 17.
For more information, visit www.esda.org.
The workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits, advanced semiconductor system on chip, and system in package applications. This event is closely aligned with the association’s EOS/ESD Symposium.
Presentation proposals are sought on novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, ESD testing, ESD characterization, system level ESD issues, or unresolved issues.
The workshop takes place May 14-17, at the Stanford (CA) Sierra Conference Center. Abstracts are due Nov. 17.
For more information, visit www.esda.org.
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