SAN JOSE -- ROHSUSA, an industry-led effort to repeal the European ban on lead in electronics, is seeking signatories for an official exemption request for lead in solders now being considered by the European Union.
According to John Burke of ROHSUSA, more than 280 signatures have been received thus far in support of the exemption. Letters must be received by Jan. 10. A link to a sample letter is here.
BANNOCKBURN, IL – After nearly 15 years and plenty of promise but few successes, the IPC today disbanded its Government Relations committee.
The committee has been a focal point for years, having acted as the
trade group’s member liaison to its lobbying activities. It coordinated
an annual industry lobbying day, and helped to raise the industry’s
awareness – if not its influence – at the congressional level.
HERNDON, VA - The International Electronics Manufacturing Initiative’s(iNEMI’s) workshop on the availability of SnPb-compatible BGAs, originally scheduled for January 24, has been moved to March 1. Hosted by Hewlett-Packard, the workshop will occur at its Cupertino, CA campus.
The workshop is intended to facilitate discussion among high-reliability electronic product manufacturers and makers of electronic components manufactured in ball grid array (BGA) packages.
iNEMI’s SnPb BGA Availability Task Group has assembled information that will be shared with BGA device makers, including a list of critical BGA component families; estimated total available market (TAM) for these devices in SnPb assembly versions; a general business case based on TAM; and scenarios to support this critical market need until reliability issues are resolved for high-reliability, long-life electronic assemblies.