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COLORADO SPRINGSIC Interconnect, a wafer bumping company, was named sole North American representative for Jiangyin Changdian Advanced Packaging, a provider of bumping technologies. The agreement establishes ICI/jcap International, the marketing, sales, engineering and customer support arm of JCAP in North America. Under the agreement IC Interconnect can install and operate its electroless nickel UBM process at a plant in China.

HIALEAH, FL -- Simclar Inc. reported fourth-quarter net income rose 394% to $949,000 on an 83.5% hike in sales to $33.2 million. The figures include the consolidated operations of Simclar and its subsidiaries, including acquisitions made during the year.

For the year ended Dec. 31, Simclar had net income of $2.9 million compared to $947,000 in 2005. Sales rose 90% to $116 million.
In a statement, chairman Sam Russell said growth has come from new and existing customers looking to consolidate their business with suppliers.




MINNEAPOLIS -- HEI Inc. today announced lower second-quarter results for the period ended March 3.

The designer and manufacturers of medical equipment systems and devices said net sales fell 10% to $10.6 million compared to the prior year. Gross profit fell by about half, to $893,000.

Net sales at the company's flexible substrate business were lower on an order drop from a primary customer looking to cut inventories. RFID orders slowed as well.



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