News
ORLANDO – Celestica Inc. was honored with three awards from the SMTA this week in Orlando. The awards recognize Celestica's technology leadership and contribution to the SMTA's technical education and collaboration initiatives.
Celestica was presented with the SMTA Corporate Partnership Award in recognition of its support of the association's global technical and certification programs. Celestica is the only company to have won the award twice.
Engineering principal Jeff Kennedy accepted the Founders Award for contributions to the industry and the SMTA. Since joining the SMTA in 1988, Kennedy has been a local chapter driver and has been involved in national SMTA conferences as a speaker and chairman. He also launched and chaired the association's Medical Electronics Conference during its first two years.
<!--[if !supportEmptyParas]-->Heather McCormick, process development engineering advisor, received an award for the Best International Paper of the 2006 conference proceedings. The award recognized “Mixing Metallurgy: Reliability of Tin-silver-copper (SAC) Balled Area Array Packages Assembled Using Tin-lead (SnPB) Solder.” The paper was written by McCormick and co-authors Simin Bagheri, Polina Snugovsky, Craig Hamilton, Zohreh Bagheri, George Riccitelli and Ramesh Mohabir. <!--[endif]-->
Celestica was presented with the SMTA Corporate Partnership Award in recognition of its support of the association's global technical and certification programs. Celestica is the only company to have won the award twice.
Engineering principal Jeff Kennedy accepted the Founders Award for contributions to the industry and the SMTA. Since joining the SMTA in 1988, Kennedy has been a local chapter driver and has been involved in national SMTA conferences as a speaker and chairman. He also launched and chaired the association's Medical Electronics Conference during its first two years.
<!--[if !supportEmptyParas]-->Heather McCormick, process development engineering advisor, received an award for the Best International Paper of the 2006 conference proceedings. The award recognized “Mixing Metallurgy: Reliability of Tin-silver-copper (SAC) Balled Area Array Packages Assembled Using Tin-lead (SnPB) Solder.” The paper was written by McCormick and co-authors Simin Bagheri, Polina Snugovsky, Craig Hamilton, Zohreh Bagheri, George Riccitelli and Ramesh Mohabir. <!--[endif]-->
BANGALORE – Cookson Electronics will open a state-of-the-art research center here later this month. The 32,000 sq. ft. facility will aid semiconductor and alternative energy research, and help boost Asian sales, which currently make up 60% of the company's assembly materials business.
CANJAN, FRANCE – Electronics manufacturer Flextronics intends to close its Canjan plant in the French region of Aquitaine, the company says.
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