News
EDINA, MN – Amkor Technology COO and executive vice president Oleg Khaykin will keynote this year’s International Wafer-Level Packaging Conference.
The talk will take place on Sept. 18 in San Jose.
The 4th Annual IWLPC runs Sept. 17-19, with full-day workshops, a technical conference and a tabletop exhibition.
For a complete program schedule and registration visit www.smta.org/iwlpc.
The talk will take place on Sept. 18 in San Jose.
The 4th Annual IWLPC runs Sept. 17-19, with full-day workshops, a technical conference and a tabletop exhibition.
For a complete program schedule and registration visit www.smta.org/iwlpc.
LONDON — Tin prices are slipping — slightly — on the London Metal Exchange after matching an 18-year high of $15,700 a ton last week. Supplies of the metal, a key element in electronics solder and plating, have been under pressure due to disruptions in Indonesia and Bolivia.
TAIPEI – Acer Inc. has countersued Hewlett-Packard, alleging violation of four patents, the PC maker said today.
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