News
COPENHAGEN -- Lego Group is taking its toys and going home. Europe's largest toy maker will end its outsourcing deal with Flextronics next year and bring manufacturing back in-house, the company said today.
"During the past year it has become increasingly obvious to the two parties that it would be more optimal for the Lego Group to manage its global manufacturing set up," Lego said in a statement.
"During the past year it has become increasingly obvious to the two parties that it would be more optimal for the Lego Group to manage its global manufacturing set up," Lego said in a statement.
SAN DIEGO – Pulse, an electronics component and subassembly designer and manufacturer, announced its Sonion Division will operate under the Pulse name, effective today. Sonion will undergo a name and legal entity change over the coming months.
The Technitrol Co. subsidiary’s activities related to hearing instrument components, pro-audio and medical device components will continue as a new group called MedTech. The mobile terminal components and MEMS microphone activities will become part of Pulse’s existing Wireless group.
Technitrol acquired Sonion on Feb. 28 and became part of the firm’s Electronic Components Segment.
Sonion is based in Roskilde, Denmark and has facilities in Poland, China, Vietnam, the US, and the Netherlands.
The Technitrol Co. subsidiary’s activities related to hearing instrument components, pro-audio and medical device components will continue as a new group called MedTech. The mobile terminal components and MEMS microphone activities will become part of Pulse’s existing Wireless group.
Technitrol acquired Sonion on Feb. 28 and became part of the firm’s Electronic Components Segment.
Sonion is based in Roskilde, Denmark and has facilities in Poland, China, Vietnam, the US, and the Netherlands.
SHANGHAI – Henkel and Shanghai University, along with other research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.
“One-third of Henkel’s Shanghai-based 150-person research and engineering team is dedicated solely to technology development activities, and over 3% of our research and development expenditure is earmarked for cooperative efforts with universities and technology institutions,” said Dr. Horst Eierdanz, corporate vice president, Henkel R&D Engineering Adhesives.
The roadmap of the three-year project includes study of the interfacial bonding mechanisms between metals and organic polymers; new latent curing systems for advanced electronics polymer applications; fundamental studies of the rheological behavior of microelectronic assembly materials; nanocomposite microelectronic packaging materials, and advanced microelectronic thermal solutions.
The duration of the project is scheduled through March 31, 2011.
The official signing ceremony took place June 10 at Henkel Asia-Pacific and China Headquarters in Shanghai.
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