Loctite 3508 cornerbond underfill material for BGA and CSP devices is a one-component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Can be applied inline with existing capital equipment, with curing during the solder reflow process. Is Pb-free compatible and permits rework. Has a pot life greater than 30 days. 
Henkel Corporation, www.henkel.com/electronics
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