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Stackpole Electronics has released the RVCA Series automotive-grade thick-film high voltage chip resistors. Designed for high-voltage applications requiring compact form factors and extended resistance ranges. Anti-sulfur compliant per EIA-977 and validated through load life, biased humidity, short-time overload and temperature cycling testing to support use in harsh automotive and industrial environments. Supports resistance values from 30kΩ to 100MΩ and voltage ratings up to 3kV in the 2512 case size, with 0805 and larger packages rated at 400V minimum.
PST Series Si Thermal Test Die are for thermal characterization and temperature measurement of semiconductor packages. Silicon thermal test die with embedded resistive heaters. Heat generated by low current enables controlled temperature rise and measurement. Used for thermal analysis, package evaluation, and research applications. Available in waffle packs or unsawn full wafers. In stock and ready to ship.
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ORLANDO, FL – The 2026 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers. ECTC 2026 will take place May 26-29, 2026 at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend.
Abstract submission will open on August 18, 2025, and the deadline for submissions is October 6, 2025. For all details and to submit an abstract, please visit the ECTC 2026 Call for Papers.
The ECTC 2026 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, chiplet architectures, hybrid bonding, WLP and PLP, fan-out and fan-in packaging, flip chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing and systems, and other emerging technologies in electronics packaging.
Previously unpublished, non-commercial paper abstracts are requested in areas including:
- Applied Reliability
- Assembly and Manufacturing Tmetechnology
- Electrical Design and Analysis
- Emerging Technologies
- Interconnections
- RF, High-Speed Components & Systems
- Materials & Processing
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies
- Photonics
- Interactive Presentations
VADODARA, GUJARAT, INDIA – Aimtron Electronics has secured approximately $12 million through the issuance of convertible warrants to fund a new electronics manufacturing facility here. The financing round, approved by the board, saw participation from promoter group members Mukesh and Nirmal Vasani and institutional investors.
BANNOCKBURN, IL – North American printed circuit board (PCB) shipments jumped 21.4% year-over-year in May, according to new data from the IPC trade group. Shipments increased 7.1% month-to-month, with year-to-date sales up 7.9%.
