Converging Products, Expanding Supply Chain
The “iNEMI Roadmap 2007” edition, available this month, provides a more global perspective than any previous version, with representation from all major regions. Here, future research, development and implementation needs are identified.
Wave Solder Fluxes
Wave Soldering Flux Selection for Pb-Free Assembly
Both the manufacturing and end-use environments play big roles in flux selection. A look at the design, process and reliability implications of each major type of flux.
Chrys Shea, Sanju Arora and Steve Brown
Effective Lean Six Sigma Deployment in a Global EMS Environment
The fusion of Lean Six Sigma has achieved results more effectively and efficiently than either quality program does alone. Here’s how to avoid the most frequent cause of failure: putting it into practice.
Dr. Harjinder Ladhar
Quickturn BGA Reballing
A new, quickturn technique for reinstalling balls on “BGA” components relies on laser-cut polyimide stencils and fixtures, and is designed to place new solder balls onto array-style components in small volumes (fewer than 100 devices).
Machine software is the next big thing.
Focus on Business
The post-RoHS EMS world.
Go Mexico, instead of China.
Steven A. Colantuoni
On the Forefront
What’s in your phone?
E. Jan Vardaman
All fueled up.
The under-discussed threat of copper dissolution.
Flip chip RF vs. wirebonding.
American Competitiveness Institute
Solder bridging corrective actions.
Test and Inspection
Keeping up with new packages.
Stacy Kalisz Johnson
Control the process, or just test it?
Pb-Free Lessons Learned
Placement horror stories.
Effects of surface finishes on joint voiding.
Dr. Renzhe Zhao
Viscom’s combination AOI/x-ray.
SMT/Hybrid/Packaging and Nepcon China Product Previews
On the cover: Balls are re-soldered onto a grid array. (Photo courtesy Cookson BEST)