February 2005 cover


  • Cover Story
    Making the 'Centigrade'
    The inside story of how Motorola qualified a lead-free alloy.
    Vahid Goudarzi and Grahame Freeman

  • New Packaging
    An Alternative PCB Architecture for High-Speed Chip-to-Chip Signal Transmission
    Think copper hits its wall at 10 Gbps? Think again. A novel chip package achieves 40 Gbps by routing high-speed signals through the top side.
    Joseph Fjelstad

  • Quality Control
    Demystifying Six-Sigma
    Industrial processes have always demanded the utmost repeatability, to maximize yield within accepted quality limits. We reveal secrets of what machine specification sheets really mean, and how to read them.
    Bruce Brigham

  • Reflow Soldering
    Nitrogen's Effect on Pb-free Soldering
    How and why the inert atmosphere lowers soldering temperatures, improves wetting and reducing voids.
    Paul Stratton

  • Connector Finishes
    Potential for Whisker Formation in Pb-Free Electroplated Connector Finishes
    Of 20 lead-free electrodeposited connector finishes studied, a matte finish or bright pure tin over a nickel barrier were found to be least susceptibile to tin whiskering.
    B. Rickett, P. Elmgren, G. Flowers, S. Gale, and J. Suhling

  • Testing and Analysis
    COTS Ruggedization Simplified
    How to be sure that off-the-shelf parts meet high-rel requirements.
    Linda Britt

  • Outsourcing Models
    Defense and Aerospace Outsourcing Trends
    The must-have capabilities of the defense sector's EMS firms.
    Jeff Kaylor


  • Caveat Lector
    Better enjoy your spam.
    Mike Buetow

  • Talking Heads
    Henkel's Pat Trippel.
    Mike Buetow


  • Global Sourcing
    Verifying supplier capabilities.
    Don Payne


  • On the Forefront
    Calling the future.
    Ken Gilleo

  • Screen Printing
    Common features affecting printer performance.
    Joe Belmonte

  • Better Manufacturing
    RoHS: Obnoxious and noxious.
    Phil Zarrow

  • Countdown to Lead-Free
    Complying with RoHS.
    Holly Evans and Joe Johnson

  • Process Doctor
    Is surface contamination really a problem?
    Terry Munson

  • Equipment Advances
    Siemens' Siplace X series.
    Tom Foley

  • Technical Abstracts


Industry News
Market Watch
Assembly Insider
Ad Index
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On the cover: Lead-free products cause a sea change. (© UP Media Group)

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