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Designed for the manufacturing floor, X1550 features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Reportedly low-maintenance, requiring minimum operator intervention.
 
Offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom). Said to be easy to learn, use and maintain. Has large-board handling area (18 x 24"), magnification 700X, high MTBF, fully integrated compact system and image archiving in popular file formats.
 
Provides high-contrast resolutio, has integrated motion control and image measurement analysis.
 
Incorporates a manipulator design that is said to provide fast, accurate, repeatable sample positioning; Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability; and CMOS-based 12 bit solid-state detectors. 
 
Comes with an advanced image processor and a complete library of measurement and analysis tools. NEXUS 300 software has: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement (ADE) module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
 
VJ Electronix, vjelectronix.com
Booth A1 339

 
RoHS Compliant SuperM.O.L.E. Gold thermal profiler contains no lead or the other banned substances in the board finish, components or hardware.
 
Companies that are or will manufacture lead-free electronics products can specify a RoHS Complaint thermal profiler for developing and managing their soldering recipes. 
 
ECD, ecd.com
Booth A4 240
Coming Soon...
Aquanox A4630, the latest aqueous electronics cleaning material, was designed to clean lead-free materials while providing low cost of ownership. Said to bring ambient temperatures and low concentrations while exceeding industry standards for personnel and environmental safety.
 
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Reportedly provides brilliant joints, pass after pass, without the use of sump side additives. Equally effective on all no-clean materials.
 
Is easy to use, people-safe and environmentally friendly. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
 
Kyzen, kyzen.com
Booth A4 323/2 Read more ...
EnviroMark 907 (EM907) no-clean, lead-free solder paste is designed for  the higher thermal demands of higher melting temperature lead-free alloys.
 
Said to feature a long stencil life and offer lead-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec.). Reportedly has excellent cold and hot slump behavior, thus preventing bridges and solder ball formation.
 
Has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, even in air reflow, an added benefit during inspection. Leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites and meets J-STD-004 Flux Classification ROL0.

Kester, kester.com


Booth A4 363

Finetech will co-sponsor and participate in the Lead-free Interactive Forum in booth A6.105 during  Productronica.
 
The Forum is a daily hands-on experience with aspects of lead-free materials and production equipment. Participants will learn about current process experience in soldering, inspection, component requirements, printed board design/specification, product reliability and rework. The Forum will offer a mixture of free technical presentations, panel discussions and hands-on demonstrations in a live production environment.
 
As a Process Provider, Finetech will demonstrate advanced rework equipment, and will have a technical expert available to provide advice on how to implement and improve  lead-free rework yields.
 
Each day during the show, a panel discussion will be held covering different aspects of the manufacturing process. Topics will deal with specific questions posed by registered visitors. Finetech’s Gunter Kuerbis will participate on the Friday panel covering inspection, test and rework.
 
Finetech, finetechusa.com

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