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TORONTO -- SMTC Corp., a mid-tier EMS provider, has begun building assemblies and perform final integration for an unspecified program for Telco Systems. No financial terms were announced.

Telco is a wholly owned subsidiary of BATM Advanced Communications,  a provider of carrier-class transport and access gear for IP and TDM networks.

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SMTC is performing printed circuit board assembly and full chassis fabrication, integration and testing. Production began last quarter and will ramp to volume through the first quarter 2006.

SMTC is building assemblies in Toronto, and conducting chassis fabrication, PCBA integration, final test, and configuration in Boston.

ANGLETON, TX -- Benchmark Electronics reported sales of $625 million for its fourth quarter, up sharply from $524 million last year. Net income was up $4.5 million, to $24.7 million, for the quarter ended Dec. 31.

The company said it will expand its low-cost capacity while realigning elsewhere, specifically in in the U.K. It said it would take a $3.5 million to $4.5 million pretax charge for the closure of its U.K. facility.

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ANAHEIM, CA — Another Apex has come and gone, and what have we learned?

That the industry is busier today than it was a year ago.

That most -- but not all -- companies expect another solid year in 2006.
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ATLANTA -- Industry analyst Walt Custer will present his take on the global economic situation  in a free presentation over the Internet later this month.

The live two-hour Webinar takes place Feb. 28, at 2 pm EST. To register, go to www.pbrseminars.com.
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SARATOGA, CA – Revenues and unit sales of ICs worldwide are expected to be in the double digits, says a leading research firm.

Revenues and unit sales grew 7.8% and 10.6%, respectively, in 2005, Advanced Forecasting said.
Read more ...
SAN JOSE -- IBM Technology Group director Tim Collopy will keynote the IEEE International Reliability Physics Symposium this year’.

IRPS will be held March 26 to 30, in San Jose.

Collopy’ will address adaptating reliability methodologies to market expectations and technology roadmaps. He asserts that fundamental reliability models and qualification methods have not changed in decades. In order to accommodate unique customer requirements (e.g., foundry) or industry standards, Collopy suggests enhanced quality processes and the stress, analysis and repair of new fail modes uncovered during new technology development.

The addition of feedback from the full spectrum of users to verify these models and methods allows for continuous improvement of quality processes, just as customers demand of microelectronic products and technologies.

Collopy joined IBM in 1974 and has served in his current position since 2001. He graduated the University of Missouri – Rolla with bachelor's degrees in mathematics and electrical engineering, and a master's in operations research, and has an MBA in plans and controls from Union College.

He has previously held management positions in process engineering, diagnostics and characterization, manufacturing engineering, reliability engineering and analytical services at IBM's East Fishkill, NY ,semiconductor facility.

Visit the IRPS Website at irps.org.

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