BURLINGTON, VT -- The 50 largest EMS companies topped $100 billion in sales for the first time, accounting for 2005 revenue of $109.2 billion.
Combined sales
for top 50 companies grew 14.4% in 2005. Growth was heavily
influenced by the estimated results of Hon Hai
Precision Industry (Foxconn); without Hon Hai, the remaining 49 providers produced an aggregate growth of 3.1%.
SAN JOSE -- Hammer Storage, a
division of Bell Microproducts, has added the Hammer NA-1400 Network-Attached Storage Appliance to its
product line.
The high capacity device provides up
to two terabytes of external storage in a compact, toaster-sized package.
It is designed by Newisys Inc., a developer of
computing and storage designs, and manufactured by its parent company
Sanmina-SCI.
SAN JOSE -- Flextronics International today agreed to sell a majority stake in its software development business to private-equity firm Kohlberg Kravis for $900 million.
Flextronics expects to receive $600 million in
cash consideration and $250 million in notes with a 10.5%
paid-in-kind interest coupon which matures in eight years.
Flextronics expects to net $175 million after taxes upon closing, which is expected this summer.
SALT LAKE CITY -- CirTran Corp. reported record sales and narrowed its net loss by 20% for its fiscal year ended Dec. 31.
The contract manufacturer reported a net loss of $527,708 on net sales of $12.99 million, up 46.6% from fiscal 2004. Gross profit rose 243% to $6.3 million.
FRANKLIN, MA – The U.S. Patent Office has issued a patent to Speedline Technologies for the method first used its Accela printer’s stencil wiper system.
US Patent no. 7,017,489 covers a method used to minimize downtime from wiper service during the printing operation.
This method can be used on screen and stencil printers.
Joe Perault, Speedline manager of applications engineering, is credited with the invention.
HERNDON, VA and PISCATAWAY, NJ —The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components and Technology Conference (ECTC). The workshop is scheduled for May 30, at ECTC in San Diego.
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.