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Taiwan -- BenQ has consolidated its Asia and Europe handset product houses in a move to speed up product launch time, according to Digitimes.


The product houses provide functions including technical product management, R&D, strategic procurement and supply chain management.


Jochen Eickholt, current head of BenQ mobile houses for Europe and Latin America and Irwin Chen, president of BenQ's wireless business unit, will jointly lead the new team, Digitimes said.
VANCOUVER -- Nam Tai Electronics has invested $30 million in the acquisition of machinery, new production lines, etc., to develop internal manufacturing operations.
 
To support its existing flexible printed circuit (FPC) subassembly business, the company has invested in FPC manufacturing, which involves the etching of a copper printed circuit onto a flexible plastic film and assisting customers in the design of the circuit layout. 
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San Jose -- With 116 billion ICs produced in 2005, the value of the worldwide IC packaging market was $23.1 billion in 2005, reports Electronic Trend Publications. Of this worldwide total, 37 billion ICs were assembled by contract packaging companies for a value of $9 billion.

 
The report predicts that the worldwide semiconductor industry will ship 193 billion ICs in 2010. At that time, the value of the IC packaging market will be $34.6 billion.

SAN JOSE -- The Semiconductor Industry Association today launched a new website on America’s competitiveness. The site is the latest in a series of activities designed to focus attention on steps to take to ensure American leadership in innovation and technology.

The site, located at www.choosetocompete.org, details the industry’s importance to the everyday life of Americans and the need for public policies that foster a competitive economic environment for Information Technology industries.

“For more than 50 years, America has been the world leader in innovation and technology,” said SIA president George Scalise. “Leadership in innovation and technology has been essential to continuous improvements in the U.S. standard of living, increased productivity and higher wages for American workers, and ensuring national security. Today other nations are working very hard to replicate our model for success. This Website presents a series of broadly supported public policy initiatives designed to meet the new global competitive challenge and secure America’s leadership in technology and innovation.”

The site includes information showing the importance of increased federal support for basic research at U.S. universities, updated education and immigration policies that will allow American companies to maintain employment within its borders, and economic policies that enhance the climate for investment in high-tech facilities for manufacturing, research and development, and product design.

Other areas of the site provide information on critical applications of chip technology – from agriculture to medical science and national defense. The site also features news updates on the growing momentum for action on bipartisan proposals on American competitiveness, information on proposed legislation and links to partner Websites.

In April SIA will add an interactive tool outlining the key points in the modern technology timeline, illustrating the critical role of semiconductors in a broad range of applications, and presenting the challenges now faced by America’s technology sector.
Rome, NY – The ESD Association has scheduled an ESD Device/Design Seminar to be held at its Rome headquarters May 1-2. Developed by the ESDA’s Professional Education Committee, the technical seminar will cover on-chip ESD protection designs.
 
The seminar will focus on: ESD in the industrial semiconductor IC context; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements, including RF, and their impact on ESD; CDM ESD protection; and design examples and case studies.
 
The course is required for ESD Certified Professional-Device/Design certification.
 
Instructors are Charvaka Duvvury, Ph.D., Texas Instruments, and James W. Miller, Freescale.
 
For more information, visit esda.org/documents/DeviceDesignSeminar-2006_Rome.pdf
MURRAY HILL, NJ -- The on-again, off-again merger talks between Lucent Technologies and Alcatel are on again. The two telecom companies disclosed last night that discussions are underway, but said there would be no further comment until a deal is complete or talks are called off.
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