News
FRANKFURT -- Consolidation continued in the telecom space as Nokia and Siemens announced the combining of heir mobile-network operations to create a 50:50 joint venture with annual revenue of about $20 billion.
The new entity will be called Nokia Siemens Networks and is expected to be finalized by year-end, pending regulatory approval.
The new entity will be called Nokia Siemens Networks and is expected to be finalized by year-end, pending regulatory approval.
NORTH BILLERICA, MA — BTU International has relocated its Southeast Asia headquarters to an expanded site in Singapore.
The new facility includes a state-of-the-art demo and training facility, comprehensive spare parts inventory, conference rooms, and increased office space to support BTU’s continuing growth in Southeast Asia.
At the opening ceremony, on Dec. 4, Boris Mathiszik, BTU’s director of sales for Asia Pacific, said, “We are very excited about our move and our resulting ability to better support our growing customer base in the region. With our branch office in Penang, Malaysia, and our Southeast Asia headquarters here in Singapore, we are able to provide our customers unmatched service and support capability.”
The new office address is:
The new facility includes a state-of-the-art demo and training facility, comprehensive spare parts inventory, conference rooms, and increased office space to support BTU’s continuing growth in Southeast Asia.
At the opening ceremony, on Dec. 4, Boris Mathiszik, BTU’s director of sales for Asia Pacific, said, “We are very excited about our move and our resulting ability to better support our growing customer base in the region. With our branch office in Penang, Malaysia, and our Southeast Asia headquarters here in Singapore, we are able to provide our customers unmatched service and support capability.”
The new office address is:
BTU Overseas, Ltd
No. 9 Kaki Bukit Road 1
#02-10 Eunos Technolink
Singapore 415938
Tel : 65-67414567
CeTaQ Americas has expanded machine performance verification services to include verifying placement of very tiny passive chip components to 01005 size. Such components, loaded from tape and reel, are difficult to place accurately and repeatably, and require that placement equipment operate within tight performance tolerances and accuracy to minimize defects.
General manager Mike Sivigny said, “These chips are so tiny that pad dimensions and geometries are measured in microns. If a placement machine is not operating fully within a manufacturer’s stated accuracies, there will be a higher rate of defects and reduced yields. These components are already responsible for higher defect levels than larger scale components, and are the focus of considerable process optimization efforts within the industry. Additionally, their tiny size makes manual rework difficult, compounding the negative impact of defects caused by inaccurate placement.”
The most common problems found on chip placement equipment, Sivigny adds, are systematic offsets, per head, per nozzle, per angle or simply a general offset. Offsets negatively affect chip shooter accuracy, resulting in PCB defects, lower yields, and costly manual rework. With growing demand for 01005 chip usage, placement accuracy is increasingly important.
General manager Mike Sivigny said, “These chips are so tiny that pad dimensions and geometries are measured in microns. If a placement machine is not operating fully within a manufacturer’s stated accuracies, there will be a higher rate of defects and reduced yields. These components are already responsible for higher defect levels than larger scale components, and are the focus of considerable process optimization efforts within the industry. Additionally, their tiny size makes manual rework difficult, compounding the negative impact of defects caused by inaccurate placement.”
The most common problems found on chip placement equipment, Sivigny adds, are systematic offsets, per head, per nozzle, per angle or simply a general offset. Offsets negatively affect chip shooter accuracy, resulting in PCB defects, lower yields, and costly manual rework. With growing demand for 01005 chip usage, placement accuracy is increasingly important.
PHOENIX – Anoraks with printed heating elements. LEDs, non-emitting displays, photovoltaics on rigid substrates. Low-weight, high-rel military applications. These were just some of the uses of printed electronics displayed and discussed at IDTechEx’s annual Printed Electronics USA in December. More than 300 delegates attended this year's event, which was characterized by demonstrations of market-ready products. Three U.S. military talks illustrated how this sector is still advancing faster than most. Here the objective of reducing the weight of a soldier’s pack by two-thirds was just as important as multipurpose items, such as the tent that doubles as an antenna and photovoltaic power supply. T-Ink demonstrated new applications of existing printed technology such as batteries, sensors, buttons and lights. Flexible OLEDs, as displays, signage or lighting, now look 10 years away, but electrophoretics are already here with flexible versions coming much sooner. Some pundits are forecasting printed flexible OLEDs at low volumes for the next few years, but flexible electrophoretics volumes are predicted to be much higher. Many forms of photovoltaics now look launchable in 2007. Printed thin film transistor circuits remain a year away, but many working samples were displayed. Most agree that a high percentage of printed electronics applications in the next few years will be from applications created from new markets. Some in printed conductors are considering developing semiconductors. Others hope to replace indium tin oxide semi-transparent electrodes in OLEDs, AC electroluminescent displays and so on. Here progress is slow, but HC Starck is a leader. Conductive plastics with better than resistor-like performance are still elusive. However, these problems are all seen as commercial opportunities. Giants of the chemical, plastics, printing, packaging and electronics industries were all present to see how they could participate in this new industry, with its potential for hundreds of billions of dollars annually, dwarfing the success of the silicon chip.
HERNDON, VA – iNEMI’s Tin Whisker User Group has revised “Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products.”
MINNEAPOLIS, MN – The SMTA is offering two more process certification workshops in 2006. Each SMTA Certification program, one for SMT Processes and one for Six Sigma Green Belt, is a three-day workshop consisting of refresher topics and examinations. The workshop assumes that the participant has at least 2-3 years of SMT experience and has an educational background equivalent to two years or more of college in a technical discipline.
SMTA Certification is not an entry-level program. Basic algebra and statistics will be used in the workshop and examination. The examination requires written answers and some calculations.
Remaining programs include:
SMT Processes Certification
August 22-24
Heraeus, Inc. - West Conshohocken, PA
SMT Processes & Six Sigma Certification
September 25-28
Donald Stephens Convention Center - Rosemount, IL
For full details, visit http://www.smta.org/certification/certification.cfm
SMTA Certification is not an entry-level program. Basic algebra and statistics will be used in the workshop and examination. The examination requires written answers and some calculations.
Remaining programs include:
SMT Processes Certification
August 22-24
Heraeus, Inc. - West Conshohocken, PA
SMT Processes & Six Sigma Certification
September 25-28
Donald Stephens Convention Center - Rosemount, IL
For full details, visit http://www.smta.org/certification/certification.cfm
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- Altus Group Expands Sales Support Function with New Appointment in Ireland
- Kitron Secures EUR 37M order for Next-Generation Tactical Communication Equipment