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ENDICOTT, NY -- Endicott Interconnect Technologies has achieved "Approved Vendor Status" for PWB design, fabrication and circuit card assembly by Raytheon Computer Products, a business unit of Raytheon's Network Centric Systems Division.

Endicott Interconnect supplies PCBs, organic chip carriers and first- and second-level assemblies to the defense and aerospace markets. It also suppliers chip packaging, PCBs, electronic assemblies, electro-mechanical equipment and services to the computer, telecommunications and communications markets.

Torrance, CA – Excellon Automation has opened its new corporate offices and North American production facility in Rancho Dominguez, CA. The relocation efforts will be completed by mid-October.

“Our current facility is outdated and no longer supports our North American production needs or provides the necessary capabilities for our world headquarters operations, “ said David Balsbough, president. “With our increased emphasis on customer support and technology leadership we need a facility that supports these objectives while providing efficient and flexible operating capabilities.”

TOKYO -- Sony's new CEO didn't wait long to shake up the company, as the consumer electronics giant announced plans to close 11 factories and cut 10,000 jobs from its electronics business.

Howard Stringer, the media executive whom Sony hired to revitalize its listing electronics business, said the cuts will save $1.8 billion in costs by the end of fiscal 2007. The company revised downward its forecast for the fiscal year ending in March to a net loss of $89.8 million.

AUSTIN -- Smart Modular Technologies has inked a deal to license module and package stacking technologies from Staktek Holdings.

Smart makes memory products; Staktek is a provider of intellectual property and services for chip-stacking and module technologies.

Under terms of the agreement, Smart can use Staktek's ArctiCore technology for module products, and will be licensed to offer stacking technology for leaded and BGA packages. Financial terms were not disclosed.

SHEFFIELD, UK - Jennic, a fabless semiconductor company, has purchased an Agilent RF IC tester. The equipment will be installed at its Sheffield headquarters.

Jennic is expected to use the 93000 SoC series tester for product validation and multi-site test development for its JN5121 IEEE802.15.4 wireless microcontroller.

The acquisition of the tester is considered to be a first for a UK fabless semiconductor company.

In a statement, Paul Wells, VP of manufacturing at Jennic, said, "In order to meet volume delivery requirements for our single chip low power wireless microcontroller, we need to ensure we have the right manufacturing infrastructure. By making major investments in a state-of-the-art tester and establishing strong relationships with world class suppliers, we are able to source large volumes of high quality products for our customers."

NEW YORK -- Semiconductor customers will continue to increase consumption of multichip devices and PLDs over the next 12 months, suggests a recent survey of purchasing managers.

Investment bank SG Cowen said today that its poll of 250 procurement specialists provides "multi-year empirical data ... and serves as an important, independent validation."

The firm said 65% of participants expect year-over-year gains in purchases of chipset solutions and reference designs in the next 12 months. This is an increase from each of SG Cowen's three prior surveys, conducted in last February, October 2004 and July 2003.

Thirty-two percent of participants expect to increase purchases of PLDs within the next 12 months. This is unchanged from February but up 10 points from the July 2003 survey.