News
PALO ALTO -- SiliconPipe received the Frost & Sullivan 2005 Excellence in Technology Award in the field of system-level interconnect solutions for its Novias technology. The technology is based on the removal of performance-limiting and expensive plated vias from the interconnection channel.
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The award is presented yearly to the company that has pioneered the development and introduction of an innovative technology into the market; a technology that has either impacted or has the potential to impact several market sectors.
AUSTIN, TX – 3M Electronics’ advanced laminate, 3M Embedded Capacitor Material, is RoHS compliant.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
LONDON – Isola Group is set to buy Polyclad Laminates from Cookson Group (the parent company of Cookson Electronics) for $91 million. The deal is expected to close in February.
Combined, the companies would be neck-and-neck with Nanya as the second largest supplier of laminate materials, behind Matsushita. Polyclad had sales of $171 million through the third quarter of 2005, while Isola said its revenues will top $400 million this year.
Combined, the companies would be neck-and-neck with Nanya as the second largest supplier of laminate materials, behind Matsushita. Polyclad had sales of $171 million through the third quarter of 2005, while Isola said its revenues will top $400 million this year.
LONDON -- The U.K.'s top energy official today suggested that the deadline for implementation of the Waste Electrical and Electronic Equipment directive would be pushed back.
In a statement, Energy Minister Malcolm Wicks said progress on the implementation of WEEE is to be reviewed immediately. "We have listened to the concerns expressed by both the business community and other stakeholders over the implementation process and have decided that more time is needed to get the implementation right. Although any further delay is regrettable, this will ultimately deliver far greater environmental benefits."
In a statement, Energy Minister Malcolm Wicks said progress on the implementation of WEEE is to be reviewed immediately. "We have listened to the concerns expressed by both the business community and other stakeholders over the implementation process and have decided that more time is needed to get the implementation right. Although any further delay is regrettable, this will ultimately deliver far greater environmental benefits."
Jena, Germany – GÖPEL electronic will partner with PTS (Production Test Systems Ltd), headquarted in Shenzhen. PTS becomes the 11th Center of Expertise (COE) in GÖPEL’s electronic Alliance Partner Network (created to support JTAG/Boundary Scan applications).
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
Minneapolis, MN -- The SMTA International Technical Committee is asking for abstracts for the 2006 conference. Short course descriptions are also being solicited. The deadline for abstracts is Feb. 24, 2006; the SMTA International show is set for Sept. 24-28 in Rosemont, IL.
Sumit abstracts online here: smta.org/smtai/call_for_papers.cfm.
Paper are being solicited in emerging technologies, components, assembly, PCB technology, process control and business issues. Visit the Website for further specifics.
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment