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KYOTO, JAPAN - The Omron Group reported fiscal 2007 net sales of 763 million yen, up 5.4% over last year. Net income rose 10.7% to 42.4 million yen.

Sales were boosted by the weaker yen and business acquisitions.

Operating income rose 5.2% to 65.3 million yen. EBITA from continuing operations fel 0.2% to 64.1 million yen.

Omron makes factory automation equipment and electronics and automotive components.

BREDA, HOLLANDCobar Europe BV, member of the Balver Zinn Group and supplier of solder pastes, fluxes, and other electronics soldering materials, has acquired a global license to distribute solder pastes and wire using the SN100C alloy developed by Nihon Superior Co. Ltd.
 
The license permits Cobar Europe and Cobar Solder Products to sell SN100C solder paste and wire in specific territories allocated by Nihon Superior.
 
No financial terms were disclosed.

SN100C is a patented nickel stabilized tin/copper alloy that is based on the eutectic 99.3% tin 0.7% copper with a trace amount of nickel.
SIEVI, FINLAND – EMS provider Scanfil reported first-quarter profits rose 16% from a year ago to 3.6 million euros despite a 4% drop in sales to 50 million euros. Operating profit rose 31% to 4.7 million euros.

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BANNOCKBURN, IL – March PCB shipments among North American fabricators rose 9.5% year-over-year, while bookings jumped 11.2%. Rigid shipments were up 9.5%, and flex shipments were up 9.7%, said IPC.
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GREENVILLE, SC – Component maker Kemet Corp. reported its executive vice president and chief financial officer David Gable is resigning.
 
Gable leaves the company to pursue other avenues, Kemet said.
 
The company announced a restructuring plan in January that will dissolve 120 jobs in the U.S. and 250 jobs in Mexico, with some work moving to China. The company said the job cuts would save about $16 million annually, with a one-time cost of about $7 million.
 
Gable will remain with the company during the search for a successor.
EDINA, MNSMTA has issued a call for papers for SMTA China South (Aug. 26-28) and SMTA China North (Nov. 10-11).
 
These events will be held in conjunction with Nepcon South China and Bohai Electronics Week.
 
Topics to be covered include 01005 and chip-scale-package assembly; 3D SiP; challenges of PCB fabrication technology and surface finish; component supply integrity; cost reduction initiative; advanced low I/O packaging; flex circuit assembly; market trends in assembly manufacture; manufacturing engineering; materials and process characterization; Pb-free processes and product reliability; package on package; process control excellence; production and supply chain management; RoHS compliance and materials; risk-free rework/repairing, and inspection and failure analysis.
 
SMTA requests technical papers for the technology or vendor conferences. Papers are requested in both Chinese and English; Chinese presentations are recommended.
 
The deadline for abstracts for China South is May 15, and for China North, July 10.
 
Submit abstracts to peggy@smta.org.

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