News
ROCKVILLE, MD – Rochester Electronics has established a Design and Technology Group here, expanding its capability to recreate semiconductors discontinued by the original manufacturer.
The new group specializes in ASIC designs and can reverse-engineer products where original tooling and intellectual property is missing or unavailable. Rochester has licensing deals in place with original component manufacturers to support these activities, the company says.
"There are many devices discontinued by the original manufacturer that are critically required in systems needing a long term support solution. In many cases, there simply is insufficient inventory of finished devices or die," said Curt Gerrish, Rochester founder and CEO. "Through Rochester's authorizations and licensing from the original manufacturer, we are able to recreate the device from the manufacturer's IP or through device reverse engineering."
"There are many devices discontinued by the original manufacturer that are critically required in systems needing a long term support solution. In many cases, there simply is insufficient inventory of finished devices or die," said Curt Gerrish, Rochester founder and CEO. "Through Rochester's authorizations and licensing from the original manufacturer, we are able to recreate the device from the manufacturer's IP or through device reverse engineering."
SILVER SPRING, MD – The International Electronics Manufacturing Initiative is offering a medical electronics forum on Nov. 14 in Silver Spring, MD.
This free event, hosted by the US Food and Drug Administration, will discuss requirements and recommendations developed for the electronics industry to ensure reliability of components used in medical products.
Forum topics include existing and related standards and test methods; use conditions for life-critical medical components; test and extrapolation methodologies; sampling population assessment; range and conditions of applicability; test methodologies and criteria; medical grade guidelines; failure modes and effects analysis of MLCC failures, and accelerated life test methods to determine long-term leakage and breakdown failures of MLCCs.
Register by Oct. 31 at http://www.inemi.org/register.php?id=63.
NASHVILLE -- Sean McShefferty, a veteran of more than 20 years in electronics manufacturing and North American electronics sales manager at Kyzen, died Oct. 12 following a long battle with cancer.
In a statement, Kyzen vice president Tom Forsythe said, “It is with deep sorrow that we received word of Sean McShefferty’s passing. Sean has battled stomach cancer for nearly two years and until quite recently had remarkably maintained a near-normal schedule, not only managing to continue with his duties at Kyzen but also being active at his church, in outreach programs for cancer awareness, as well as supporting other cancer patients and survivors.
In a statement, Kyzen vice president Tom Forsythe said, “It is with deep sorrow that we received word of Sean McShefferty’s passing. Sean has battled stomach cancer for nearly two years and until quite recently had remarkably maintained a near-normal schedule, not only managing to continue with his duties at Kyzen but also being active at his church, in outreach programs for cancer awareness, as well as supporting other cancer patients and survivors.
SAN JOSE -- North American manufacturers of semiconductor equipment booked $754 million in orders in
September 2008 on a three-month average basis, down 13% from revised August figures and off 39% year-over-year.
The book-to-bill ratio was 0.76, meaning $76 worth of orders were received for every $100 of product billed for the month, SEMI said.
MILTON, NY -- Sono-Tek's August quarter sales rose 13% year-over-year to $1.61 million but the company swung to a net loss of $177,000.
For the period ended Aug. 31, the Company reversed its previous year's profits of $12,000, citing increased spending on technical and market developments for a new business development program.
Chairman and CEO Dr. Christopher L. Coccio attributed the increase to the new business development program, and noted that the sales increase was based on products such as the Exactacoat and Flexicoat, which serve the new solar and fuel cell markets, WideTrack systems for new glass customers and our first textile finishing system, and the new line of SonoDry ultrasonic spray dryers for the pharmaceutical and nanotechnology industries.
For the period ended Aug. 31, the Company reversed its previous year's profits of $12,000, citing increased spending on technical and market developments for a new business development program.
Chairman and CEO Dr. Christopher L. Coccio attributed the increase to the new business development program, and noted that the sales increase was based on products such as the Exactacoat and Flexicoat, which serve the new solar and fuel cell markets, WideTrack systems for new glass customers and our first textile finishing system, and the new line of SonoDry ultrasonic spray dryers for the pharmaceutical and nanotechnology industries.
SMYRNA, GA – UP Media Group Inc. seeks abstracts for PCB Design Conference East 2009, to be held Apr. 27 - May 1 in Waltham, MA.
The event at Westin Waltham Boston includes a one-day exhibition on Apr. 29.
PCB East is a five-day conference focusing on PCB design, engineering and fabrication. The conference is comprised of a three-day technical conference and a professional development certificate program of one- and two-day courses.
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations, two-hour workshops, and half-day seminars.
Papers and presentations of one-day and two-day tutorials are sought for a professional development certificate program.
Suggested topics include high-speed, high-frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; Pb-free processes (especially how they affect design and fabrication); environmental legislation (REACH, RoHS, etc.) and its effects; RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; surface finishes; industry forecasts, and business and supply chain issues.
Submit abstracts by Nov. 14 at www.pcbeast.com/speakers/abstract.shtml, or email requested information to knargitoth@upmediagroup.com.
If selected, final papers and presentations will be due in March.
Printed Circuit Design & Fab and Circuits Assembly magazines are media partners for the event.
For more information, visit www.pcbeast.com.
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment