SOUTHFIELD, MI – A project team made up of Chrysler, Ford and General Motors has developed a process to help automotive suppliers remove lead-based solder from electronics components used in vehicles.
iNEMI is scheduled to discuss findings at industry venues worldwide, including Apex on Mar. 31 in Las Vegas; SMTA China East on Apr. 21 in Shanghai; at the Astride the Packaging Roadmap seminar, held at TWI Ltd. on Apr. 22 in Cambridge, UK, and at the European Microelectronics & Packaging Conference June 15-18 in Rimini, Italy.
The 2009 Roadmap covers five product sectors and 20 technology and business topics. For additional information, visit http://www.inemi.org/cms/roadmapping/2009_Roadmap.html.
NEW YORK -- Electronic manufacturing services revenues in Europe are forecast to decline 13% this year, according to a new report.
LAKE FOREST, CA -- EMS firm Probe Manufacturing is betting its future on its past. The company is returning its cofounder to the chief executive's chair, bringing Kam Mahdi back to the position he held from 1996 to 2005.
HOFFMAN ESTATES, IL – Bosch Rexroth AG, parent company of Bosch Rexroth Corp., reported $8.3 billion in 2008 sales, up 9.8% year-over-year.
Sales in the Americas were up nearly 8%. The company anticipates a significantly weaker performance for the current fiscal year, but said it is maintaining its R&D investment.
The Bosch subsidiary spent around $364 million on R&D in 2008, or 4.5% of sales.
The growth experienced last year by the manufacturer of drive and control technologies was led by developments in the German, European and Asian markets.
TAIPEI – Compal raised its shipments forecast for the current quarter, guiding for a 20% sequential gain.