GTI-5000 x-ray image processing software upgrade includes two new features: Video Recorder and Image Analysis Workstation.
Video Recorder allows streaming of full-sized (640 x 480) grayscale x-ray images to disk at up to 30 frames/sec. Images are captured and written to disk in real-time, saved as an AVI video file. Can be played back later for analysis, releasing the x-ray inspection system for immediate inspection of other samples.
The Image Analysis Workstation can analyze (or confirm) x-ray inspections at a remote location. Allows viewing of saved x-ray images in the form of still images or video clips.
Designed for manufacturers using x-ray inspection to monitor assembled components in laboratory and production environments, said to provide accurate measurement and analysis for rapid, reliable x-ray inspection of BGA components and PCBs.
Glenbrook Technologies, www.glenbrooktech.com
EASYpick Trak3 components are said offer increased functionality, improved ergonomic features and advanced diagnostic tools. Hardware developments enable higher productivity and accuracy in order fulfillment operations, compared to conventional pick-to-light systems.
Snap into the track at the pick face with a cable-less connection, for easy reconfiguration. The standard 4" wide pick-to-display and 2" pick-to-light components are compact and permit dense placement and precise alignment with the pick location.
Acknowledgement buttons on the devices are designed for durability and easy response to finger pressure. Pressed buttons will make a connection if any of four touch actuators are engaged. An elastomer keypad design provides reliability and eliminates the possibility of keycaps falling off
Replace the single incandescent gumball picking direction light used in conventional picking units with six small, bright and easily readable LEDs. Depending on function, devices can display red, amber or green lights, and can be set for static illumination or intermittent flash.
Has self-diagnostic tools that can be run at the device and/or the network level, reducing the time required to isolate faulty hardware. Feature embedded device-level software that automatically checks and self-corrects common problems caused by power fluctuations or severed power connections.
The pick-to-light version uses pick lights to indicate bin location and bay displays to indicate picking quantities. Pick-to-light devices, like pick-to-display pick lights, can function in a dual mode controlling an upper and lower location. Also available for left/right location for pallet picking.
FKI Logistex North America, www.fkilogistex.com
The Micro thermal imaging system for microscopic applications consists of the Infrasight thermal imaging camera, microscopic 20 μm lens, optical mounting table, vertical focusing stage, locking xy stage with micrometers, adjustable cooling fan, Dell tower PC with LCD multimedia monitor, required cables and Thermalyze image analysis software.
Optional accessories include a thermal stage and controller, I/O module with eight relay outputs and wide-angle lens (resolution 100 μm to ∞).
The camera obtains the temperature at 19,200 individual points on each image with temperature sensitivity of 0.2˚C for the microscopic lens and 0.1˚C with wide angle lens.
The software provide real-time (30 frames/sec) viewing, automatic emissivity correction and analysis tools to obtain the temperature information needed.
Useful in R&D, design, and troubleshooting applications.
OptoTherm Inc., www.optotherm.com
EASYLINE 8088 is a die bonder for sensor assembly. Applications include pressure sensors, accelerometers, gyroscopes and other components related to the automotive, biomedical and IT markets. Offers high-volume die bond technology at an attractive price - performance ratio for the sensor and micro assembly market.
Features high-speed air bearing pick-and-place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and fully automatic wafer handling system. To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.
Can handle substrates like lead frames, premolded lead frames and ceramics up to 4.5 x 4.5", great for sensor-related die bonding. Allows exact dispensing of epoxies and solder pastes. The closed-lopped linear motor pick tool provides active control of the placement height, for stable bond line thickness. An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.
Front access to all major systems simplifies the operation. Footprint is 1m2.
Alphasem, alphasem.com