Service Pack 3 (SP3) is now available for P-CAD 2004, the PCB design system. Available as a free download to existing licensed customers, the upgrade has over 160 new features and enhancements.
Productivity enhancements include variants, layer stack up and configuration of options. A significant upgrade was made to the P-CAD TIES Viewlogic/ePD interface, which now supports eProduct Designer (ePD) 2004 SP1. It allows the transfer of electrical design information between the Viewlogic/ePD CAE design tools and P-CAD’s tools, and offers cross-probing plus forward/backward annotation. The PADS / P-CAD translator now handles non-English characters.
The number of component libraries has been significantly increased; includes 80,000 total available components.
Has an increased number of CAM file export options. Users can output an IPC-D-356A formatted net list, including netlist connectivity data and blind and buried via information. Default settings for apertures, design rules, grid settings,and pad styles can now be stored and applied automatically to new designs. Library Executive has also been enhanced with a “Save to File” option.
content life cycle from change orders through release approval, dissemination and training. Allows firms to improve enterprise-wide visibility of process changes, reduce risk and labor costs associated with use of erroneous and outdated procedures, and demonstrate regulatory compliance.
Provides an intuitive workflow environment to manage the entire lifecycle of content (procedures, specifications, drawings, etc.) via integrated change orders, version control and training tasks.
Benefits include: • Managing and distributing content, including SOPs, procedures, drawings and datasheets. • Facilitating compliance with regulatory requirements and standards including cGMP, ISO 9000, 21 CFR Part 11, SOX, and HIPAA • Making relevant content easy to locate, view, print, e-mail and download. • Providing full text search across the entire content repository. • Automatic notification regarding new, updated and recalled documents. • Supervisors can manage employees, assign new hire document training and training for new roles and document monthly activity. • Content managers define a document’s affected areas, automatically set training tasks and access rights and also receive automatic notifications of document change request status.
DX dispensing system includes a mobile hand-held dispenser with a refill station, for two-component material dispensing.
Can dispense 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios for two-component reactive resins. Multiple hand-held dispensers can quickly be refilled with one DXR refill station. The refill station uses two transfer pumps that feed from five-gallon bulk containers of material, each equipped with follower plates to handle a range of viscosities. Is lightweight, compact. MIXPAC Equipment, mixpacequipment.com
ESD Drawer Storage Cabinets are certified to meet specific electrical property requirements, assuring static dissipation at a safe rate. Can be protected by static dissipative powder coat finishes in five standard colors. Drawer interiors can contain conductive plastic boxes and conductive slotted grooved trays for additional protection.
Cabinet drawers feature a 440 lb. load capacity each and are available in seven full sidewall heights for maximum cubic storage capacity. Extend 100% from the housing for complete use of the furthest corners and easy accessibility to all the contents.
Additional ergonomic and safety features include drawer handles positioned at the top of each drawer and flush with the face of the housing. Also, the one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.
AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking.
Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure.
The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials.
The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.
SAC4-XM7S solder-paste provides the desired properties for lead-free applications without the use of nitrogen blanketing or extended profiles to minimize ΔTs.
Said to deliver excellent results in applications requiring extended heating profiles. Remains stable and active during extended heating at elevated temperatures and offers a robust printing window. Available in most common SAC-alloys and in several powder classes.