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3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.

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XM Bond high-resolution camera is for inline wire bond inspection.

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SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.

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ST 925 combines ST 325 programmable convective/hot air rework station, PH 100 low profile IR preheater and ST 500A Z-axis platform.

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Supreme 3HTND-2DM rapid curing, toughened, one-part epoxy is for chip-on-board encapsulation using the dam-and-fill method.

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ETS Series test fixtures conform to a standard size (2.50” x 2.75” square), and include mounting holes for easy stacking.

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