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2102cover

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  • How QFN package construction affects solder joint durability
  • Effects of under-stencil wipe chemistry on SMT printing
  • The future of desktop PCB tools
  • Overcoming Covid stagnation
  • Post-Covid sales and marketing
  • Common stencil printing problems
  • Solder toes
  • Download the pdf
Mike Buetow
CAVEAT LECTOR

Can Luxshare topple Foxconn?

Mike Buetow

Susan Mucha
FOCUS ON BUSINESS

Why you should consider a certification program.

Susan Mucha

Alun Morgan
MATERIAL GAINS

What Industry 4.0 can mean to you.

Alun Morgan

Bob Willis
DEFECT OF THE MONTH

Component pin float issues.

Bob Willis

PCD&F/CIRCUITS ASSEMBLY EDITORIAL CALENDAR 2021

 

Issue

Editorial Deadline  Advertising Materials Deadline  Featured Market          Special/Bonus Distribution*
January 23-Nov    14-Dec Automotive  
February           18-Dec   14-Jan    Military/Aerospace Design-2-Part (Grapevine) 
March 20-Jan 17-Feb Wearables IPC Apex Expo, Design-2-Part (Atlanta, Plano)
April 19-Feb 15-Mar  Communications  DesignCon, Design-2-Part (San Jose), SMTConnect 
 May 19-Mar  14-Apr  Medical Design-2-Part (Schaumburg, Minneapolis)
 June 20-Apr 14-May EMS PCB EAST, Design-2-Part (Santa Clara, Nashville)
 July 20-May 14-Jun IoT/IIoT SemiCon West
 August 21-Jun  12-Jul PCs/Computing Nepcon South China
 September 20-Jul  9-Aug PCBs PCB WEST Preview, 
 October 20-Aug  14-Sept Smart Manufacturing PCB WEST
 November 20-Sept 13-Oct  Industrial Productronica, SMTAI, TPCA Show 
 December 20-Oct 12-Nov  AR/VR HKPCA Show 

 *Subject to change.

 

Regular Coverage

  • CAD tools
  • CAM
  • Cleaning
  • Component assembly/placement
  • Components/packaging
  • Design tips
  • Documentation
  • Drilling/routing
  • EMC/EMI
  • ESD
  • Flex circuits
  • Industry 4.0/smart factories
  • Laminates/materials
  • Layout/placement/routing
  • Lean manufacturing
  • Library management
  • Procurement/supply chain management
  • Screen/stencil printing
  • Soldering
  • Power integrity/signal integrity
  • Wet processing (plating, etching)
  • Tech teardowns
  • Test/inspection
  • QA/QC
Jan Vardaman
ON THE FOREFRONT

R&D: The roots of the manufacturing tree.

E. Jan Vardaman

Alun Morgan
MATERIAL GAINS

What Industry 4.0 can mean to you.

Alun Morgan

Bob Willis
DEFECT OF THE MONTH

PCB delamination root causes.

Bob Willis

Robert Boguski
SEEING IS BELIEVING

Unsolicited advice for the morning spammers.

Robert Boguski

David Bernard
TEST AND INSPECTION

Low temperature solders under x-ray.

David Bernard, Ph.D.

Jan Vardaman
ON THE FOREFRONT

R&D: The roots of the manufacturing tree.

E. Jan Vardaman

Alun Morgan
MATERIAL GAINS

What Industry 4.0 can mean to you.

Alun Morgan

Bob Willis
DEFECT OF THE MONTH

PCB delamination root causes.

Bob Willis

Robert Boguski
SEEING IS BELIEVING

Unsolicited advice for the morning spammers.

Robert Boguski

David Bernard
TEST AND INSPECTION

Low temperature solders under x-ray.

David Bernard, Ph.D.

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