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Mike BuetowAs we come to the end of our run of articles excerpted from the 2017 iNEMI Roadmap, it gives us time to reflect on the nature of roadmaps in general and their value to the industry.

I’ve always been a fan of them. My history with the document dates to the earliest interconnect roadmap, developed by IPC in 1994. As a cub reporter, I covered the series of meetings that led to the first PWB roadmap. The energy was palpable. We really felt like we were saving the industry.

Subject experts acted as chairs for the respective working groups, each tasked with developing a chapter. Each chapter reflected the biases of those who developed it. That first tome ran a scant 172 pages and reviewed nine technology areas, primarily bare boards, assembly, packaging, and components. The development process hasn’t changed dramatically since then, even as the sheer volume of what is described has exploded.

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Peter BigelowAnd the path forward is all around us.

At industry events and when visiting with like-aged colleagues, I often hear reminders of “the good old days.” Such comments typically arise while discussing the difficulty finding, recruiting and retaining bright young talent. On one level I agree, especially when long-gone fun times and great friends come to mind. On a more focused, pragmatic level, however, I am thinking, “Things are exactly like they were in those days, and maybe it’s time that changed.”

Many of those old friends were, in their day, just as immature, impatient, all-knowing and audacious as the generation coming of age now. What’s changed is our perspective.

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Mike BuetowWhat’s in a name?

We probably ask that question about 10,000 times over the course of our lives. It often starts with our own. How many times did you complain – loudly or under your breath – about your own name? “Mine’s too common/uncommon/plain/weird,” etc. A name is just a name, but for many juveniles, it’s their introduction to branding.

I attended a parochial school for eight years. At one time, no fewer than five of the 20 or so boys in my class were named Michael. And “it wasn’t me, it was the other Mike” could only fool the nuns for so long. At one point, probably around third grade, in the faintest of hopes to distinguish myself, I remember telling classmates and teachers to call me by my middle name: John.

That didn’t take either. And so went my early attempts to raise my “personal brand.”

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John BornemanBut don’t obsess over the distribution.

Yes, I said it. Normal data are nearly never normal.

In Six Sigma classes we study outliers, shift, drift and special cause events. But what we don’t always consider is that these “unexpected” data points may be part of the process and not as rare as we think.

First, let’s look at a set of screw torque data. The chart in FIGURE 1 is for a set of screw torques taken sequentially from a “smart” driver. We can see the data are normal (p=0.895), and the histogram and time series plot back that up.

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David BernardThere are more solder balls to inspect, so use oblique views.

With board area often at a premium in today’s sophisticated and high-performance electronics, using the third dimension of height to enable greater device functionality is ever more attractive. In particular, package-on-package (PoP) devices have been around for years and are popular for this purpose. From an x-ray inspection point-of-view, the most common POPs can be considered as two BGAs stacked on top of each other. Therefore, the real and “virtual” issues associated with BGAs, as mentioned in previous columns, also come into play for these devices.

However, we now have an additional dimension (sic) to consider in the features seen in the x-ray images, as well as just having a single BGA and anything within, or on the second side of, the board. On top of these, we also have the potential for overlap of solder balls from the two BGA layers (FIGURES 1 and 2). As with BGAs, all the interconnections are underneath the package, and are not visible optically, permitting x-ray the opportunity to make nondestructive inspection analysis. With twice the number of BGAs in the same place, does this mean twice the number of potential problems or more?

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Tim O'NeillCould vendor collaboration get to the root cause of an intermittent soldering problem?

Simply put,  the ultimate function of a PCB assembly line is to create millions of solder joints without error. This task is complicated by the myriad materials that come together during assembly, and relies on the quality of each lead, pad and sphere to be soldered. When a soldering defect is discovered, it is common practice to presume the soldering materials are the cause, which seems logical, considering it is a solder defect. This assumption is often misplaced. This scenario plays out regularly, as illustrated in a recent case submitted to our failure analysis team for diagnosis.

In this case, the assembler had an intermittent solderability issue with a component. It brought the problem to its local representative’s attention on several occasions. The issue was isolated to a single component and was repairable at the rework station. It was a nuisance but didn’t interfere with production schedules. The situation was difficult to address; it was intermittent and subtle, but persistent. And each time the representative brought its solder supplier’s field engineer for site visits, the solderability issue was not present. Solder companies detest these types of issues because they have a negative effect on customer satisfaction and product perception.

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