CAMBRIDGE, UK – The high-temperature and time-consuming reflow process leaves space for electrically conductive adhesives, according to a new IDTechEx report. ECAs comprise a metal powder embedded within a polymer resin and are well suited to applications that require electronic components to be mounted on anything other than a conventional FR4 substrate, especially when the substrate material is thermally fragile.

WASHINGTON – Global semiconductor industry sales were $47.2 billion in August, an increase of 29.7% year-over-year and 3.3% sequentially, says the Semiconductor Industry Association.

TAIPEI – Foxconn reported record-high third quarter sales of NT$1.4 trillion (US$50 billion), up 8.8% year-over-year and 3.4% sequentially.

SAN LUIS POTOSI, MEXICO – CCL Industries has signed a binding agreement to acquire Desarrollo e Investigación and Fuzetouch (Singapore) (collectively D&F) for some $50.7 million, according to reports.

WASHINGTON – The US Defense Department is allocating another round of funding to a research effort for lead-free electronics in high-performance defense areas.