Kyzen Corp.
will showcase AQUANOX A4630 in booth 2D01 at the upcoming Nepcon China/EMT China show in Shanghai.
The product was designed to clean Pb-free materials while providing low cost of ownership. The sixth-generation product brings ambient temperatures and low concentrations while exceeding industry standards for personnel and environmental safety.
Is typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Said to provide brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
Effective on all no-clean materials.
Is multi-solder safe for Pb-free and Pb-bearing solders in addition to most precious metals. It is part marking safe and compatible on all tested electronics industry labels (polyimide).
Kyzen Corp., kyzen.com
-
Details
-
Written by Mike Buetow
ENDICOTT, NY -- Endicott Interconnect Technologies and
Meadville Technologies Group Ltd. have entered a licensing agreement to produce EI's patented organic substrates at the Meadville's facility in Shanghai.
Under terms of the agreement, EI maintains control of the design, prototype, new product introduction, low to medium volume production, particularly for aerospace and defense applications, sales and technical support worldwide for the CoreEZ product line. Meadville will perform high volume runs of CoreEZ products.
No financial terms were disclosed.
-
Details
-
Written by Mike Buetow
VANCOUVER, BC -- Nam Tai
Electronics has invested $3.4 million in three surface mount lines this quarter, raising its production capacity by about 17% based on passive chip placement.
-
Details
-
Written by Mike Buetow
SHANGHAI -- Boosted by demand from
Samsung and
LG Electronics, Chinese PCB fabricators are getting more orders for optoelectronic boards,
DigiTimes reported, sourcing multiple parties.
According to those sources, optoelectronic PCB demand could grow 60 to 100% this year. Per
DigiTimes, "sources estimated that a minimum of 2.4 million square feet of PCBs will be required to fulfill domestic demand in eastern China."
AU Optronics and
Chi Mei Optoelectronics are two of the biggest, with 700,000 to 800,000 sq. ft. produced per month. Still, Samsung and LG require as much as 2.4 million sq. ft. of PCBs per month, the report said, an amount that could rise as much as one million sq. ft. per month next year.
-
Details
-
Written by Mike Buetow
NORTHBROOK, IL --
Underwriters Laboratories Inc. is
notifying consumers that a soldering iron manufactured by
Shuang Shi
Enterprise Co. Ltd. may pose a shock or fire hazard.
The iron, model CL-3, was built in November 2004 and is identifiable by the markings "6G98," "MODEL CL-3," "E190243" and the UL
Listing Mark for the U.S. and Canada.
According to UL, the Taiwanese company shipped 2000 units.
According to UL, the securement of the power supply cord connections does not comply
with UL's applicable safety requirements. This poses a risk of electric
shock and fire hazard to users.
A picture of this product is at
www.ul.com/media/newsrel/nr031706.html.
UL recommends that users stop using the product
immediately and return it to the place of purchase.
The consumer contact for Shuang Shi is 28,
Sheng Wong Chi Hsia, Li Yu Tang Tsun, San Yi Hsiang, Miao-Li Hsien 367,
Taiwan.
-
Details
-
Written by Mike Buetow
OTTOBURN, GERMANY -- Siemens Automation and Drives has acquired the die bonder activities of
F&K Delvotec Bondtechnik GmbH. No financial terms were disclosed.
Siemens will integrate the business with its Electronics Assembly Systems division, which includes its Siplace placement machines.
The companies suggested that they would look at ways to integrate placement and die bonding processes.