Products
B1500A is a Windows-based semiconductor device analyzer that integrates capacitance versus voltage (CV) and current versus voltage (IV) measurements. Provides a complete, self-contained and expandable solution for parametric characterization and analysis capable of handling 65 nm lithographies and beyond. Has a 10-slot configuration and supports EasyEXPERT software.
Supports three SMU types:
o High-resolution SMU (HRSMU)
o Medium-power SMU (MPSMU)
o High-power SMU (HPSMU)
A multi-frequency capacitance measurement unit is also available, and a 4.2 amp ground unit is included.
Besides integrating CV measurement into the device analyzer mainframe, the MFCMU can measure capacitance at up to 5 MHz and provide ± 25 V of DC bias. The combination of the MFCMU and SMUs within the same instrument enables these measurement resources to be more tightly coupled. When joined using the SMU CMU Unify Unit, supports capacitance measurement with ± 100 V of DC bias.
SCUU connects the two SMUs and the MFCMU together and can switch between the measurement resources without using a separate external switching matrix. Software handles all of the IV-CV switching, compensation and return path issues.
Can be used for a range of characterization needs for semiconductor devices and emerging materials, including nanotechnology devices.
Agilent Technologies Inc., www.agilent.com
Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.
The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.
"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.
Bliss Industries, blissindustries.com
HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.
Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.
Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.Mydata Automation
Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15. The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15.
The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.
The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.
Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.
Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.
Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.
J P Sercel Associates (JPSA), www.jpsalaser.com
The x-ray tube-based XLt is the first handheld x-ray fluorescence (XRF) instrument.
A proprietary calibration algorithm said to effectively, accurately covers the range of plastic samples used in manufacturing, while eliminating any need for user interaction or calibrations. Unlike benchtop systems, can be used on the assembly line, in the warehouse or as a benchtop instrument operated via wireless connection to a PC or PocketPC device.
Provides fast, accurate confirmation analysis of lead-free solder and electronic components, insuring compliance with European Union directives slated to go into effect in July 2006.
Automatically encrypts analysis results against unauthorized editing.
Calibrated for the quantification of Cadmium (Cd), Lead (Pb), Chromium (Cr),
Antimony (Sb), Tin (Sn), Mercury (Hg), Bromine (Br) and other toxic metals.
Niton, www.nitom.com
A variety of accessories for P2010 multi-stage ejector vacuum pump are available. Designed to save energy costs, space and time, they create more versatility in functions for electronic manufacturing applications requiring light and reliable pick-ups.
Can be accompanied by one type of Blow-off, four types of Quick-Release and one DIN-rail mounting bracket. The accessories are mounted by pressing the two stems of either aluminum housing into the push-in connections of the housing. The DIN-rail mounting bracket is fastened by screws to the four connection holes on the underside of the pump.
Quick-Release can be redesigned to suit a variety of applications, as the user can add any desired number of tanks. The units can all be complemented with a vacuum switch in M5 thread, PNP or NPN design. The vacuum switches can be connected either directly to the M5 thread of the housing or to the M5 thread of the Blow-off unit.
The pump stands 1.08" high and weighs 0.54 ounces. Driven by compressed air, does not require motor and oils.
PIAB Vacuum Products, www.piab.com
The next-generation constraint editor system (CES) to Expedition Series and Board Station RE PCB design flows is now available. Enables definition, adherence and verification of physical constraints throughout the entire PCB systems design process for complex designs. Tightly integrates with the design flow from schematic entry through physical layout, facilitating multi-disciplined communication of high-speed design rules ad constraints between engineers, designers and their tools.
Povides a unified interface for design engineers and layout designers to specify and verify constraints. Constraints can be entered in terms familiar to team members through a common GUI and then automatically accessed by individual tools in their native formats. Features automatic differential pair identification and constraint templates. Advanced automatic topology and an interactive tuning meter are enabled when used in the design flow.
Design rules and constraints can be developed and modified throughout the design process. These rules and constraints then become intellectual property (IP) that is available to designers and engineers for their current and future designs.
Supports bi-directional cross probing, which highlights and selects between a spreadsheet-based constraint interface and the schematic capture and layout tools, enabling designers to view nets and constraints in their native environment. Constraint values are fully synchronized during the forward and backward annotation process with intelligent handling of connectivity changes. Nets can be constrained by one rule at the class level, significantly reducing the number of constraints manually entered in the design. Supports user- and pre-defined automatic topologies.
Mentor Graphics Corp., mentor.com
GTI-5000 x-ray image processing software upgrade includes two new features: Video Recorder and Image Analysis Workstation.
Video Recorder allows streaming of full-sized (640 x 480) grayscale x-ray images to disk at up to 30 frames/sec. Images are captured and written to disk in real-time, saved as an AVI video file. Can be played back later for analysis, releasing the x-ray inspection system for immediate inspection of other samples.
The Image Analysis Workstation can analyze (or confirm) x-ray inspections at a remote location. Allows viewing of saved x-ray images in the form of still images or video clips.
Designed for manufacturers using x-ray inspection to monitor assembled components in laboratory and production environments, said to provide accurate measurement and analysis for rapid, reliable x-ray inspection of BGA components and PCBs.
Glenbrook Technologies, www.glenbrooktech.com
EASYpick Trak3 components are said offer increased functionality, improved ergonomic features and advanced diagnostic tools. Hardware developments enable higher productivity and accuracy in order fulfillment operations, compared to conventional pick-to-light systems.
Snap into the track at the pick face with a cable-less connection, for easy reconfiguration. The standard 4" wide pick-to-display and 2" pick-to-light components are compact and permit dense placement and precise alignment with the pick location.
Acknowledgement buttons on the devices are designed for durability and easy response to finger pressure. Pressed buttons will make a connection if any of four touch actuators are engaged. An elastomer keypad design provides reliability and eliminates the possibility of keycaps falling off
Replace the single incandescent gumball picking direction light used in conventional picking units with six small, bright and easily readable LEDs. Depending on function, devices can display red, amber or green lights, and can be set for static illumination or intermittent flash.
Has self-diagnostic tools that can be run at the device and/or the network level, reducing the time required to isolate faulty hardware. Feature embedded device-level software that automatically checks and self-corrects common problems caused by power fluctuations or severed power connections.
The pick-to-light version uses pick lights to indicate bin location and bay displays to indicate picking quantities. Pick-to-light devices, like pick-to-display pick lights, can function in a dual mode controlling an upper and lower location. Also available for left/right location for pallet picking.
FKI Logistex North America, www.fkilogistex.com
The Micro thermal imaging system for microscopic applications consists of the Infrasight thermal imaging camera, microscopic 20 μm lens, optical mounting table, vertical focusing stage, locking xy stage with micrometers, adjustable cooling fan, Dell tower PC with LCD multimedia monitor, required cables and Thermalyze image analysis software.
Optional accessories include a thermal stage and controller, I/O module with eight relay outputs and wide-angle lens (resolution 100 μm to ∞).
The camera obtains the temperature at 19,200 individual points on each image with temperature sensitivity of 0.2˚C for the microscopic lens and 0.1˚C with wide angle lens.
The software provide real-time (30 frames/sec) viewing, automatic emissivity correction and analysis tools to obtain the temperature information needed.
Useful in R&D, design, and troubleshooting applications.
OptoTherm Inc., www.optotherm.com
The company will also showcase its printing platforms for SMT applications, including the Europa as well as the new Horizon variants that integrate the new Instinctiv user interface.
The company will also demonstrate VectorGuard versions of its stencil technologies, including PumpPrint stencils and new electroformed stencils, as well as stainless steel laser cut stencils. VectorGuard stencils are easy and safe to use on the factory floor, store conveniently in a space-efficient filing system and are easily disassembled at end of life.
Güler Basol, the new Product Manager for European Distributed Products (Consumables) division, will also present the regionalised strategy for its consumables business.
DEK, dek.com
Press Releases
- Danutek Celebrates its 20 Anniversary
- Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
- Kubler US Corp. Expands to Texas and Surrounding States with FHP Reps
- Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC