Bowman A Series Micro XRF measures smallest features on semiconductors and microelectronics.

NC-809 halogen-free, ultra-low residue, flip-chip flux is designed to hold die or solder spheres in place without risk of die shift during assembly.

KW30 1mm-pitch wire-to-board connector is available in two to eight positions.

EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.

High Speed Alignment software reportedly can increase speed of six-axis robots 70% and improve accuracy 50%.

Delo-Dot PN5 microdispensing valve has dispensing frequency up to 300Hz.

3Di inline AOI system is for inspection of high-density printed circuit boards and boards with combinations of small and tall components.

Unit-i1 compact inline selective soldering machine is less than 55" in length.

EO-B-023 A to E series fluxes are identical to EO-FC-006 filling compound used in tubular solders.

Structalit 5705 removable edge bonder is formulated for bonding consumer electronics components.

Critical Manufacturing manufacturing execution system v. 9 uses manufacturing-specific DevOps Center to enable software to be deployed to multiple plants located anywhere.

LineMaster Falcon Plus inline platform combines VisionPro Merlin Detech2 image- and algorithm-based AOI sensor/software technology.