Ultimus V and Optimeter are said to reduce downtime at automated dispensers. For fluids that change viscosity, Ultimus V high-precision dispenser stores and then automatically adjusts dispensing settings to keep the amount of fluid applied constant. To compensate for changing fluid reservoir levels, Optimeter automatically adjusts airflow to maintain uniform deposit size.
 
EFD, www.efd-inc.com

Atlas Cartridge Filling System is for adhesives, lubricants and other assembly fluids. Facilitates bottom-filling 2.5- to 32-oz. cartridges with consistent amounts of 2000 to 750K cps material. Is said to eliminate rework and product loss from filling cartridges with too much material. Features a compact, lightweight design that permits moving to different locations as needed; facilitates rapid product changeovers. Is easy to clean.
 
EFD, www.efd-inc.com

 

FeederMaster is the second-generation model of the multi-platform feeder test jig Feedermaster Digital. Automatically detects deviations of the feeder pick-position and records the test results. New feeder generations, including Fuji NXT, are supported.

AdoptSMT, www.AdoptSMT.com 

 

SMTrue Run Optimize offline programming and management software module is for use with LS, LE, and CS SMT pick-and-place machines. Incorporates universal CAD translator with offline job and feeder setup, programming, optimization, and management. Converts industry standard, text delimited CAD files into a machine friendly component, location, and orientation database.

APS Novastar, www.apsgold.com 

 

Alpha JP-500 is a Pb-free no-clean solder paste developed for use in the Mydata MY-500 jet printer. Is zero-halogen and -halide material, with a wide reflow profile window for good solderability on various board/component finishes. Reportedly has good and flux cosmetics after reflow soldering. Reduces random solder balling levels, and can be used for single- or double-reflow. Meets IPC-7095 Class III voiding performance. Does not require nitrogen.

Cookson Electronics, www.cooksonelectronics.com

 

FlashCORE III programming architecture is said to offer significant performance gains by increasing the download and read/write speeds by a factor of ten. Supports flash memory devices including SD, MMC, MoviNAND and iNAND. Is compatible with all existing FlashCORE algorithms and adapters; field upgrade kits are available for existing automated system installations.

Data I/O, www.dataio.com 

Model 765 needle valve is suited for non-reactive adhesives, silicone oils, inks, and solvents. Can be used in processes such as device assembly, packaging, optics assembly, and building PCBs. Offers low maintenance and precision flow control. Is integratable into process automation and robotics. Optimal operation is achieved by using the Model 345 valve controller for valve actuation.
 
Tridak, www.tridak.com

 

The AT-GDP series BGA rework station has automated device removal and installation processes. Handles SnPb and Pb-free applications consisting of components such as BGAs, CSPs, QFNs, flip chips, and other SMDs. Enables placement to within 5 µm. Split Vision Optics permits simultaneous top of the PCB/bottom of the component viewing. Creates diagonal corner viewing for alignment of larger packages at high magnification. Absence of mirrors in the optics system reportedly ensures a clear image quality. Software contains a database of predefined profiles, which can be modified. Program settings can be adjusted while profile is running. Software controls reflow via forced air, nitrogen convection top heater, and large-area Quartz IR preheater.

Advanced Techniques US Inc., www.atco-us.com

IPC-2152, Standard for Determining Current-Carrying Capacity in Printed Board Design, is for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and acceptable conductor temperature rise. Replaces IPC-2221 conductor sizing charts. Provides guidance on how thermal conductivity, vias, power dissipation, printed board material and thickness, and the presence of copper planes factor into the relationship between current, conductor size, and temperature. Establishes general guidelines for sizing conductors and contains simple charts that show testing results for both internal and external conductors in air and vacuum environments. Appendix explains how variables impact the temperature rise of a conductor, and presents charts based on copper weights. 97 pages.

IPC, www.ipc.org/onlinestore

 

 

S3088-III AOI features enlarged inspectable PCB dimensions and improved camera technology. Is for economical electronics assembly inspection, from prototype to large series. Can be deployed for paste print or placement inspection. In high-resolution mode, reportedly detects defects on 01005 components. Revised PCB transport permits boards up to 20" x 20" to be inspected. Can be equipped for extreme cycle time requirements or heavier PCBs. Offers color evaluation for angled inspections. Comes with switchable resolution with the OnDemandHR function or integrated verification.
 
Viscom, www.viscom.com

Simple Proto service supports customers with less complex product designs. Is targeted at companies doing through-hole to SMT conversions, entrepreneurs starting a company or hobbyists with simple board layout requirements and low-volume needs. Accepts designs with through-hole components, SMT passives 0402 or larger, and SMT chips with greater then 0.0020" pin pitch.

 

Screaming Circuits, www.screamingcircuits.com  Save

Checker 3G7 vision sensor features 752 x 480 pixel resolution and high-intensity white LED illumination. Can be configured as a presence or measurement sensor; can detect and inspect up to 800 parts per min. Requires no PC for setup, and can be configured in minutes using SensorView teach pendant and one-click setup.
 
Checker 272 offers the same resolution and lighting features, plus a ladder logic editor, encoder-based part tracking, and additional IO. Includes both presence and measurement sensors.
 
Cognex Corp., www.cognex.com