See-Flo 1100 is a fixed-ratio, positive displacement, meter-mix dispense system ideal for manual and automated adhesive and sealant applications. Meters low- to high-viscosity two-component materials, such as epoxies, urethanes, silicones and acrylics supplied by pumps or pressure tanks. Can be floor-mounted, mobile-cart mounted and may be process integrated with a dispensing robot assembly. For dispensing continuous precision beads.
 
Sealant Equipment & Engineering, www.sealantequipment.com

 

Over Top Snuggers substrate clamping technology clamps the board flat before enabling finite snugging and clamp control for precise board location. Pulls board flat to enable a strong vacuum tooling contact; clamps are then pulled away from the board surface to permit close edge printing. Automatically adjusts for variations in board thickness, eliminating setup requirements between production batches and runs. Automatically adjusts for out-of-parallel boards. Uses Instinctiv V9 user interface software. Is compatible with all tooling variants, including HD Grid-Lok.
 
DEK, www.dek.com

Pressurex is a thin flexible sensor film that reveals pressures from 2 - 43,200 PSI. When placed between the contacting surfaces of a flip chip bonder, it changes color directly proportional to the amount of pressure applied. Precise pressure magnitude and distribution is then determined by comparing color variation results to a color correlation chart.

Sensor Products Inc., www.sensorprod.com/pressurex

Model 780 spool valve reportedly provides a higher rate of fluid flow during dispensing.  Is designed to accommodate a broader range of fluids, including those possessing high viscosities. Is for fluid packaging operations, including filling vials, bottles and other specialty containers. Can be integrated into robotics and automated production processes. Possesses adjustable material suck-back and flow control. Is supplied with hard-coated aluminum components and Teflon seals. Comes in stainless steel and Teflon construction. Model 345 valve controller is ideally suited to actuate this valve.
 
Tridak, www.tridak.com

Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails. 
 
Fujipoly America Corp., www.fujipoly.com

 

Multicore HF108 is a Pb-free, halogen-free solder paste. Has high-speed print capability, a shelf life of up to six months when refrigerated or four weeks at room temperature, and a wide process window. 
 
Henkel, www.henkel.com/electronics

 

BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com  

MCP screen printer has a head design with variable attack angle printing that reportedly permits constant solder pressure independent of stencil thickness. Single-head system reportedly reduces maintenance by half. Board cycle time is as low as 11 sec. Reduces defect per million figures by up to 50%. Has a flat-metal single-head squeegee. Variable angle print head improves repeatability of paste deposition for 01005 components. Produces solder shapes with stencil thickness down to 50 µm, and half-edging stencils with stencil steps of 30 to 50 µm. Is ideal for PCBs mixing 01005 (0.4 mm x 0.2 mm) types with larger component sizes.
 
Assembléon, www.assembleon.com

 

DCA-FD is a modified silicone conformal coating said to dry to the touch in 20 min. Increased solids content reportedly gives 35% greater coverage per liter compared to standard DCA. Has a wide operating temperature range and is suitable for a range of commercial and high-rel applications. Has lower VOC levels compared to standard DCA. Has excellent adhesion and is resistant to most solvents, lubricants and chemicals. Is highly resistant to mold growth and UV light. Can be sprayed, dipped or brushed. Is RoHs-compliant and meets UL746CQMJU2, DEF-STAN 59/47(4), and IPC-CC-830.
 
Electrolube, www.electrolube.com 

GTO graphical user interface helps rework and assembly technicians locate single or multiple components on a PCB. Produces a unified PCB image by combining top and bottom Gerber silkscreens, pick-and-place drill files, and formatted BoM (.csv file). Creates a composite view of PCB by fusing silkscreens, parts list, and placement information into a single view, allowing locating an individual component or a group of BoM line-item components. Generates assembly notes, and automatically generates symbol/color coded assembly prints, showing exactly which parts need to be located in certain locations on the PCB. Stored project bundle creates a single file containing top and bottom silkscreen, pick-and-place, BoM, and notes to be distributed to engineering or customers.

Saelig Co., www.saelig.com

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com

PowerRepair is for de-soldering and soldering of through-hole components to PCBs. Features mini-wave soldering technology, able de-solder/solder high-pin-count components and connectors. Also handles components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all Pb-free solder alloys. Soldering nozzle is designed for high energy transfer rate, even in high-temperature applications. Features short repair cycles, and low thermal stress on the PCB and components.  All soldering parameters are programmable.

Seho Systems, www.sehona.com