A-Series pick-and-place machine reportedly now places ICs at the same speed and accuracy as chip components using the Twin Placement Robot. TPR eliminates need for extra line balancers; is ideal for DRAM placement. Reportedly places up to 111,000 cph, at accuracy of up to 35 µm. Picks components from front side tape and tray feeder. Has below 10 defects per million.

Assembléon, www.assembleon.com

Solder Plus UV is a UV-fluorescent solder paste that enables pre- and post-reflow detection of solder deposits on automated production lines. UV light source excites the paste, causing it to emit a fluorescence detectable with conventional vision systems.

Nordson EFD, www.efd-inc.com

SimuTech technology on the TD2929 is a twin track system with dual overhead gantries. Permits print, 2-D inspection, bottom-side stencil cleaning and dot dispensing simultaneously on two PCBs. Features include a dual digital servo positioning loop, vibration printing and ultrasonic cleaning. Provides high-density bottom-side contour tooling support.

P3 combines the Touch Print Digital TD2929 and the Mx400LP pick-and-place system with tray and max feeders. A dual-lane conveyor enables two PCBs to work simultaneously. Can reach placement speed of 31,000 CPH.

Milara Inc., www.milarasmt.com

XPii-II pick-and-place machine incorporates technology from the iineo platform. Benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. Features two placement heads and uses turret head, intelligent feeders and powerful software. Comes with choice of turret heads and incorporates optical sensors that can detect components as small as 01005 and as large as 50 x 50 mm from picking to placement on-the-fly. Will accommodate components supplied on tape, strip tape, stick and matrix trays. Uses integrated intelligence. Is configurable, permitting two versions: 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Has no restrictions or limitations on component range.

Europlacer, www.europlacer.com

Sentinel print verification and process management technology captures the full board image, analyzes the data and accepts or rejects the print in real time. Reportedly manages printing inputs and outputs, and integrates verification and traceability tools. Permits printing and high-speed inspection to run concurrently. Offers high-speed paste on pad, bridge detection and alignment capabilities, with vision coverage operating at 36,000 mm2 per sec. Closed-loop control manages alignment, automatic understencil cleaning operations and paste dispensing. Rejects bad boards automatically without interrupting production.  Managed through touch-screen control of Instinctiv V9 software.

DEK International, www.dek.com

SE350 3-D solder paste inspection system has calibration-free sensor technology. Zero machine-to-machine variation across the production lines. Leverages technology of SE500; is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm). 

Cyberoptics Corp., www.cyberoptics.com

FiS640 compact in-circuit tester has a small footprint that can be configured with up to 2048 all-real (non-multiplexed) channels, an analog measurement instrument, and Vectorless test techniques. Is available with a number of fixture interfaces. Test capabilities include standard shorts and opens testing; analog value and analog function testing; vectorless opens testing using ChipScan and CScan; reduced-access boundary scan testing using ScanNavigator software; fast programming of on-board flash and ISP components, and combinational testing using optional off-the-shelf test instruments.

Acculogic Ltd., www.acculogic.com

FLS 980Dxi Flying Scorpion is a double-sided, multi-probe (16) flying probe system with 3-D probing, analog, digital and boundary scan test capability on all probes (top and bottom side). Uses repeatable closed-loop linear motor drives and variable angle probe modules (0° to 6°) to maximize physical access and guarantee repeatable probing of fine-pitch devices and small components such as 0201 and 01005s. Uses vectorless test suite PinScan; detects open-pin and orientation faults on digital devices, polarized caps and connectors.

Acculogic Ltd., www.acculogic.com

Nu/Clean D.I. ELITE water deionizer is said to work with any batch cleaner. Nu/Clean D.I. ELITE Plus water treatment comes with built-in sump tank and pump; is for zero-discharge applications. Nu/Clean D.I. ELITE – Neptune works with Trident batch washer systems. D.I. beds not included.

Technical Devices Co., www.TechnicalDev.com

 

 

ProWorks is an enterprise process management software tool for managing the execution of work instructions and processes. Turns work instructions into a real-time, integrated component of the manufacturing floor. Yields reports based on real-time performance, quality, and material flow. Permits users to author and distribute work instructions efficiently. Is geared toward creating rich content with graphical information (pictures and video); acts as a portal to retrieve and store all process-related data. Database permits multi-user, multi-site environment that enables the collection and distribution of knowledge and centralizes all work instruction information. Shares data with ERP/MRP/PLM systems.

ProWorks, www.proworksinfo.com

Grid-Lok Gold fully automatic tooling solution for board and substrate support. Offers the same automation, high-density pin array and locking technology as HD Grid-Lok. Has an enhanced design and foolproof electrical connectivity ergonomics. Features a half-size control enclosure. Accommodates diverse product demands from basic SMT to high-density, double-sided assemblies. Once the substrate is loaded, the system automatically takes control to raise the high-density array of pneumatically controlled pins. These conform to the board topography, including underside components, and lock firmly into place. The support pin array maintains its configuration until independently reset for the next board. Eliminates operator intervention and reduces support tooling setup to fewer than 20 sec.

Ovation Products, www.ovation-products.de

Aquasol water-soluble solder paste can be used with any common soldering alloy. SnPb and Pb-free SAC and SN100C versions are available. Exhibits excellent performance in printing (including fine-pitch capability), placement, reflow and cleaning. There is efficient separation from the squeegee and good aperture release with long stencil life. Is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Features excellent slump resistance; residues can be removed with de-ionized water. Has extended tack time. Voiding is minimized in air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionized water with or without cleaning agents.

Cobar Solder Products, www.cobar.com