Tridak Model 475 Series diaphragm valves are designed to be used with low-to-medium viscosity fluids. Prevent fluid contact with the actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings. Offer stroke adjustment to precisely dial-in desired shot volume. Available in three configurations: Standard Model 475 dispensing valve features an UHMW polyethylene diaphragm, acetyl copolymer fluid body and hard-coated aluminum air cylinder body; Model 475-T features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body and hard-coated aluminum air cylinder body.

Tridak, www.tridak.com

The Razor Beam 0.0315" (0.8 mm) pitch high-speed/high-density strip comes in right angle and vertical orientations for parallel, perpendicular, and coplanar applications. Is designed to save PCB real estate on X, Y, and Z axes. Contacts are reportedly ideal for rugged applications with undercut retention notches that increase withdrawal force and produce an audible click when the contacts engage. Have 20 to 50 contacts per row and a choice of lead styles. Available in heights from 6 mm to 12 mm. Is RoHS-compliant and Pb-free solderable.

Samtec, www.samtec.com

The Worldwide IC Packaging Market, 2010 Edition offers an in-depth look at the worldwide integrated circuit packaging market. Provides forecasts of individual IC device markets, for units, revenue and ASP from 2008 through 2014. Forecasts package solutions for each of these markets, broken into I/O ranges. An overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions, is also provided.

Major package families include:

• Dual in-line package (DIP)

• Small outline transistor (SOT)

• Small outline (SO)

• Thin small outline package (TSOP)

• Dual flat pack no lead (DFN)

• Chip carrier (CC)

• Quad flat pack (QFP)

• Quad flat pack no lead (QFN)

• Pin grid array (PGA)

• Ball grid array (BGA)

• Fine-pitched ball grid array (FBGA)

• Wafer-level package (WLP)

Unit forecasts for die mounted using direct chip attach methods are offered. CA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

Supplies contract IC packaging market forecast, with units and revenue analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is commentary on the state of the industry.

New Venture Research, www.newventureresearch.com

MX500 fully-modularized AOI, for inspecting solder and lead defects, presence and position, correct part, and polarity for inspection down to 01005 components, is scalable and flexible. Uses a multi-lane approach, featuring a horizontal-stackable conveyor system with a primary master inspection lane that can be coupled with additional lanes to support dual-lane, triple-lane and full-fledged quad-lane configurations. Includes novel inspection sensors for speed and flexibility.

CyberOptics, www.cyberoptics.com

Cone-shaped XS filters are for Panasonic CM402 and CM602 nozzles. Come in packs of 100 and are designed for 100-series, 100S-series, 200-series, 200S-series, 400-series and 1000-series nozzles. Are compatible with Panasonic replacement nozzles for high-speed (8- and 12-nozzle, Type A-0 and A-2) and multifunctional (Type B) placement heads. Function properly with the following Panasonic/KME pick-and-place machines: CM20F, CM301-D, CM301-DU, CM301-DS, DT401, DT401-M, DT401-F, DT400-M, CM401-M, CM401-L, CM402-M, CM402-L, CM400-M, CM212-M, CM232, CM201-D, CM202-D, CM201-DU, CM202-DU, CM201-DH, CM202-DH, CM202-DHU, CM201-DS, CM202-DS, CM202-DK and CM602-L.

Count On Tools Inc., www.cotinc.com

Redesigned Siemens ceramic replacement nozzles offer placement down to 01005 components. Are compatible with Siplace, CS, CF, D1, D2, D3, D4 F5, HM, HS-60, HF, S-27, HM, X2, X3, X4, X4i and SX. Have special vacuum geometry and are ESD-safe. Bodies machined from high-strength plastic. Reportedly will not crack or break under normal working conditions. Come individually or in six-packs in 901, 902, 904, 906 and 925 versions.

Count On Tools Inc., www.cotinc.com

The IPC J-STD-001 Certification Kit now has a Pb-free option. Components are representative of those commonly experienced. Is packaged with enough components to populate the two boards provided. Permits skill development using one board and final assessment with the other. Components and boards also can be purchased individually.

STI Electronics Inc., www.stielectronicsinc.com

Uniflow3 power supply is for resistance soldering, heat sealing and conductive adhesive bonding applications. Replaces Uniflow2 power supply, and features hardware improvements, new process control features, upgraded limit and alarm options, and user interface upgrades. Uses pulsed heat technology; provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single or dual-sided edge connectors and thermocompression bonding of gold ribbon. Is used in the assembly of medical devices, cellphones, onboard computers, LCD monitors, laptops, and cockpit instrumentation and displays.

Miyachi Unitek, www.miyachiunitek.com  

Value Line of low-humidity desiccant cabinets includes three models, with internal capacities of 7, 22 and 44 ft.³. Prevents defects to components and assemblies caused when moisture content becomes vaporized if soldered under high temperatures. Safely stores MSD trays and reels for extended periods in an RH atmosphere of 5% or less. Each of the models provides two or more turbo modules designed to rapidly decline RH to this level without use of nitrogen or compressed air.

Manncorp, www.manncorp.com

BPWin version 5.10 features benefits for software support, such as email notifications, black box log visualization and label printing. An email notification feature for automated programming systems sends instant notifications of system events, plus a job summary report. Can set up email notifications to multiple users or a single user when a certain job event takes place. Black box log files can be viewed graphically with the log visualization feature. With color-coded data and letter-designated events, the log visualization feature can help determine what set of circumstances contributed to an unexpected event or other performance metric. Identifies and maintains programmed device traceability. Prints labels using dynamic data from the current job, such as device quantity, job master file name, job ID, device part number, data pattern information and system information. Interfaces with printer using Windows print driver and a text-based command language. Generates text, barcodes and RFID tags.

BPM Microsystems, www.bpmicro.com/bpwin-features.html

XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.

Vitronics Soltec, www.vitronics-soltec.com

Space-Saver BNC connector mounts on the edge of a PCB. Provides low profile for applications with tight vertical constraints. Reduces twisting stress on solder joints inherent in BNC connector mating. A notch in the connector slips over PCB edge prior to soldering, forming a tight mechanical fit that transfers majority of rotational energy to the PCB instead of solder joints. Center pin and connector body are soldered directly to a PCB, minimizing antenna effect caused by elevated mounting approaches and associated EMI/RFI problems at higher frequency ranges. Has a 75 ohm impedance and is tested to 2 Ghz.

Regal Electronics Inc., www.regalusa.com