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StencilMate polyimide stencil is for reworking and hand-placing leadless devices such as QFNs, MLFs and LGAs. Controllably bumps leadless devices. Build-to-order stencil pairs are said to prevent bridging of neighboring solder joints while accommodating QFNs into stay-in-place stencils on the PCB. After removal of the leadless device, one of the stencils is peeled from its release liner, then aligned on the part. Solder paste is then squeegeed into the stencil apertures and reflowed. After reflow and stencil removal, the device has very uniform bumps, which then permit the leadless device to be placed similar to a BGA. Other processes have a mating stencil on the PCB, and the part is then fitted into the loaded apertures and reflowed. Comes in 0.10 to 0.20 mm thickness.

BEST Inc., www.solder.net

These ionic cleanliness test systems have larger test capacity and innovative measurement software and hardware. Deliver a measurement accuracy with a range of 0.01 - 30µg/cm² (auto-ranging) and measurement sensitivity of <0.25% of range. Test times are generally less than 5 min. Deliver a test measurement accuracy of better than 0.005µS. Use a solid gold measurement cell and a ballistic amplifier in the measurement circuitry.

GEN3 Systems, www.gen3systems.com

istorage automatic modular cabinet manages SMD reels from 7 to 15, QFP/BGA trays, PTH components, PCBs, and other parts. Can handle up to 5,500 reels. Permits multiple pick of part racks. Is bar-code driven, and calculates component quantities for single or multiple orders. Includes “count down” management for MSDs.

i-tronik, www.itronik.com

SN100C P600 D4 is a halogen-free, no-clean, Pb-free solder paste that contains no fluorine, chlorine, bromine or iodine. Is said to be high reliability, for high-density assembly with stable printability; reflows easily with good wetting and minimum incidence of mid-chip balling, and low residue. Can be reflowed with profiles similar to SAC 305 and SAC 405 with 240°C peak.

Nihon Superior, www.nihonsuperior.co.jp/english/

Aquanox A4703 neutral pH aqueous cleaning chemistry reportedly is effective with concentrations as low as 3%. For use in spray batch and spray inline cleaners to remove OA, no-clean and RMA pastes and fluxes, including Pb-free residues. Is controlled by refractive index, both manually and when using an automated process control system. Completely water soluble, and operates at <~63°C. Has a flashpoint of 104°C and a boiling point of 138°C. Comes in 5, 25 and 200 l containers.

Kyzen, www.kyzen.com

Peelable Solder Mask (PSM-AF) is ammonia-free. Is noncorrosive, and for temporary solder/coating protection. Works particularly well with NiAu pad finishes.

Cobar, www.cobar.com

Peelable Solder Mask (PSM-AF) is ammonia-free. Is noncorrosive, and for temporary solder/coating protection. Works particularly well with NiAu pad finishes.

Cobar, www.cobar.com

i-SAC 387 contains cobalt for improved melting, shiny solder joints, fine grain microstructure. Also contains germanium as an antioxidant. Has a melting point of 217°C and a specific gravity of 7.5 g/cm³.

i-SAC105 has silver composition of 0.5-1.5%, and contains cobalt for bright, shiny solder joints and fine grain microstructure, and germanium. Has a melting point of 217° to 227°C and a specific gravity of 7.4 g/cm³.

Balver-Zinn, www.balverzinn.com

Cable Assembly Kits and Training support customers involved in cable and harness assembly. The kit addresses the majority of component types encountered in operational production. Uses mil spec style connectors with two sizes of contacts, combined with insertion/extraction tools. Additional terminals, solder sleeves, and crimp lug terminations are provided. Includes a terminal soldering kit. Features an overlay and wire list typical of those encountered in production operations. Is used in the NASA Cable and Harness Training program.

STI Electronics Inc., www.stielectronicsinc.com