Zebra 2005 Elastomeric Connector is for smaller consumer electronic products and commercial instrumentation. Can be ordered in application-specific widths ranging from 0.015" to 0.118". The layered carbon-filled and non-conductive silicone construction incorporates 500 conductors per in. to accommodate applications with LCD contact spacing of 0.006". Offers a current carrying capacity of 50 mA per 0.040" x 0.040" pad. Can be ordered with solid or sponge edge supports. Has low compression force material. 

Fujipoly America Corp., www.fujipoly.com

MAX series dispensing systems are configured with PCD volumetric dispense technology and a Micro-Dot pump. Are ideal for silver-filled conductive and nonconductive epoxies, solder pastes, adhesives, encapsulants and other fluids used in electronics assembly. Compatible with all GPD’s dispensing pumps, including the Micro-Dot for dispensing below 0.010". Are designed with a 100% molded, unibody frame. Have Contour Mapping software; provide ±0.001" accuracy over the entire work area. Handle up to two different dispense pumps simultaneously. Can be configured with heat for applications such as underfill, encapsulation, or others that may benefit from a heated product.

GPD Global, www.gpd-global.com

Smart GUI software for Siplace placement machines features a new graphical user interface. Displays essential data about the machine's status, current jobs and their progress. If the software detects problems on the line, it converts instantly into an analysis and instruction tool. Categorizes the malfunction and indicates the exact location (machine and track). Initiates self-healing procedures or starts a video assistant to display the steps needed to fix problems. Graphics provide a troubleshooting process step by step. Line personnel reportedly can fix more than 90% of incidents without a special technician.

ASM Assembly Systems, www.siplace.com

Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics

Cobra pick-and-place machine is a three-step SMEMA inline system, with an octagonal placement head, up to two dispensing valves, customizable machine finishing, up to 240 feeder slots, a mineral cast chassis, and ePlace software. Motion system is constructed as a real-time system that reduces the number of cables in the machine. Mounts device packages from 01005s, QFPs, complex BGAs, QFNs, CSPs, bare dies, and connectors to odd shapes up to 10 x 150 mm.

Essemtec, www.essemtec.com

SRT Micra benchtop rework platform is designed for rework of small, high-density electronic devices. SierraMate V9 software simplifies process definition; reportedly ensures consistent, repeatable results between facilities. Offers Auto-Run feature, an automated process setup tool, and virtual process engineer; minimizes rework setup and profiling times. Can accommodate 01005 passives and 0.3 mm pitch area array devices. Removes residual solder. |

VJ Electronix, www.vjelectronix.com

Seitec Bravo STS-2533 IN H & SJ soldering system is for inline and modular selective soldering. Programmable system features a special nozzle design and a spray fluxer unit. Features include a conveyor with roller, a specially designed solder pot, and a drawer-type solder pot. Is for mass production.

Seika Machinery Inc., www.seikausa.com

SpliceRite SMD lineup consists of cover tape extenders, single and double splice tapes, brass and steel clips, and specialty tapes for splice detection and for specific requirements of placement machines. Tools for tape cutting and splicing also are available. Compatible with all current brands of placement equipment.

Tonka Electronics, www.tonkaelectronics.com

This CAD conversion service when placing an order for full feature or quickturn printed circuit boards has a new native file upload functionality. Benefits include more consistent conversions; a faster transition to ordering – the need for Gerber exports no longer exists; reduced delays in manufacturing, and improved revision control. Can now order prototype boards using original design files, using one of the following packages: Altium, EAGLE, OrCad, National Instruments Circuit Design Suite, IVEX Winboard, or PCB123 CAD design software.

Sunstone Circuits, www.sunstone.com

No. 930 is an electrically-heated, 500°F inert atmosphere cabinet oven, used for liquid flow solder masking under a nitrogen atmosphere. Workspace dimensions measure 38" x 38" x 38". 30 kW are installed in Incoloy-sheathed tubular heating elements, while a 1500 CFM, 1-1/2 HP recirculating blower provides horizontal airflow to the load. Features 4" insulated walls, aluminized steel exterior, Type 430 stainless steel interior and an automatic door switch to shut off heaters and blower when the door is open. Inert atmosphere construction features include a pressure regulator, flowmeter, pressure gauge, inner oven walls sealing directly against a 1/2" thick silicone rubber door seal, air jacket on the inner oven for cooling, blower shaft seal, positive latching door hardware, adjustable offset door hinges, outlet with pressure relief, and interior seams welded gas-tight; all oven wall penetrations equipped with compression fittings.

The Grieve Corp., www.grievecorp.com

Multi-Cure 9-20557 solvent-free conformal coating contains no VOCs and cures in seconds upon exposure to UV/visible light. Is designed for rapid conformal coating of printed circuit boards and other electronics assemblies. Is specially formulated to remain on the edges of difficult-to-wet components and sharp leads. Has a secondary heat-cure feature that permits the coating to cure with heat in applications where shadowed areas exist. Is optimized for coating thicknesses between 0.002" and 0.020". Medium-viscosity material is compatible with most spray equipment. The low modulus permits it to excel in coating applications where thermal shock performance is critical.

Dymax Corp., www.dymax.com

inSite is an integrated manufacturing software system for factory speed, control, and visibility for iPad and iPhone. Brings instant mobile access to quality, WIP, performance, and traceability information. Forward and reverse traceability is available for viewing; can share via email. Can view active WIP, shipment information, and detect process bottlenecks. Quality Paretos with interactive drill-down from customer level through product and down to individual pin information. Recalls and displays the product image directly on your device. Process, product, and materials information within the Aegis MOS system is accessible.

Aegis, www.aiscorp.com