DB-1580 series conductive stringer attach adhesives are for back contact applications in crystalline silicon solar modules. Are designed to make contact from vias or other conductors in the solar cells to the back contact sheet. Are stress absorbing and have excellent conductive stability to back contact metallizations during damp heat exposure. Are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.

Engineered Conductive Materials, www.conductives.com

A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.

Assembléon, www.assembleon.com

Screwdriver System is a series of high-precision electronic and mechanical torque control screwdrivers for electronics assembly applications. Uses scalable current reference to run entire torque range of the tool. Controllers feature digital and analog hardware for application flexibility. Small controller footprint; weighs less than 4 lb. Auto-sensing input voltage; quick-change connections. ESD-safe and clean room ready.

Weller, www.weller-tools.com

Vir-Stat air ionizers (VS-100) eliminate static charges in ESD-sensitive assembly areas. Are available in various configurations. Two bench-top units direct ionized air to the workspace directly in front of an assembler. One unit has an RS485 port for data collection; the other does not. Overhead ionizing units are available for controlling larger areas. Reduce "stiction" when handling extremely small insulative components.

Virtual Industries, www.virtual-ii.com

Positive Cavity Displacement ‘H’ Series high-resolution pumps are compatible with epoxies, thermal greases, underfills, oils, silicones and UV encapsulants. Are designed for GPD platforms and may be used with other robots or tabletop operations with a tabletop controller. Viscous fluids are delivered to the substrate via luer nozzles; performance excels when using ‘S’ Taper tips. Metering technique is not affected by variations in temperature or reservoir pressure. Luer dispense tips offer higher flow rates than standard luer nozzles with a lower pressure buildup.

GPD Global, www.gpd-global.com

CM-series ionic tester uses a solid gold test-cell, ballistic amplifiers, and high-volume pumping systems. Produces complete test solution change more than 6x per min. PC-based software is used to produce graphical test data, a pass/fail analysis, and automatic hard copy print-out using test methods according to MIL and DEF standards. Features include solid gold measuring cell and ballistic amplifier, providing a test accuracy of < 0.005mS/cm; curve-fitting analysis algorithm (merit of fit); complete testing within 3 min.; full regeneration in < 6 min.; accurate measurement, and automatic temperature compensation. Measures in accordance with all international and MIL specifications, and complies with J-STD 001, IPC-TM-650, and DEF Standard 00-100/3.

GEN3 Systems, www.gen3systems.com

FX SL inspection system reportedly offers accelerated throughput at more than twice the inspection speed of previous systems. For inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Typically takes less than one hour to create a complete inspection program, including solder inspection. Inspects 01005 components. Uses a standard package library. Has Advanced Fusion Lighting and 5 MP image processing technology, including color inspection, normalized correlation and rule-based algorithms.

Nordson YESTech, www.nordsonyestech.com

Fuji XP SMT nozzles come in standard and special nozzle designs for odd-form components, such as LEDs, switches and connectors. Are guaranteed to function properly with the following pick-and-place equipment: XP142, XP143 and XP242. Nozzles are also available for XP141 series machines and XP143 with automatic nozzle changer.

Count On Tools, www.cotinc.com

THERMLfilm HT is a high-temperature polyimide film able to withstand fluctuating temperatures, abrasion and chemicals. Is for high-density barcode and alphanumeric PCB labels. Topcoat provides a smooth printing surface. Is reportedly ideal for data matrix codes; provides consistent ANSI scannability. Static dissipating qualities of the topcoat minimize the risk of print voids. Heat resistance testing has revealed endurance at 500°F/260°C continuously for 5 min. and intermittently at up to 750°F/398°C.

FLEXcon, www.FLEXcon.com/HT

SN100C (551CT) is a Pb-free, fluxed-cored solder wire formulated for soldering tip temperatures up to 380°C with good tip separation for reduced icicles. Is said to deliver an Ag-free stable microstructure. Is designed for high-speed robotic soldering processes; excellent wetting and high spread factor offer increased soldering speeds with hand soldering. Said to provide fast wetting and increased spreadability over SAC 305.

Nihon Superior, www.nihonsuperior.co.jp

CI-1083-L and CI-1081-H conductive grid inks are for use in thin-film solar modules. Have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications. CI-1083-series conductive grid inks have high solid contents and optimized rheologies to enable screen printing of high aspect ratio fine lines. Are low stress, low shrinkage thermosetting inks that reportedly offer excellent moisture resistance and low polymeric creep. Line resistivity is 8 mΩ/sq/mil (1 mil emulsion; 230 mesh).

Engineered Conductive Materials, www.conductives.com

VisionXC convection soldering system is tailored to market requirements such as those characterized by mobile device manufacturing. Has high throughput rates for high-volume production environments. Has optional dual-lane processing. Can be equipped with two conveyor lanes; can be operated asynchronously at different speeds. Can use the two lanes asymmetrically with different lane widths. Dual conveyors can be loaded with diverse PCBs printed with different solder pastes. Heating system permits selection of ideal reflow profiles for separate products.

Rehm Thermal Systems, www.rehm-group.com