Delvitech's 3iS AOI system is designed to ensure scalability and inspection repeatability on all production lines by deploying identical hardware and software technology for each inspection phase.

Hitachi's FT210 analyzer includes a proportional counter detector for routine measurements of common platings and incorporates features designed to enhance high-volume testing needs.

TRI's TR7600F2D QL AXI is designed for the evolving needs of large board applications, especially in automotive and telecommunications electronics manufacturing.

Techcon's TS60C-LL-N syringe barrel features a capacity of 177cc/6oz.

Kyocera's 159-7X0 series is its first linear card-edge connectors to feature a beryllium copper spring contact system, which is said to deliver high electrical and mechanical reliability, high signal integrity and high durability in harsh environment applications.

Vishay Intertechnology's series of 10MBd high speed optocouplers provides low power consumption to save energy in industrial applications.

Stirri's LT-HF solder paste is said to be the world's first low-temperature halogen-free solder paste with an optical tracer.

ViscoTec's eco-PEN XS 180 volumetric microdispenser precisely dispenses quantities as small as 0.25μL and beads as narrow as 0.1mm, depending on the material.

ASMPT's CMAT-S is an all-in-one system for assembling and dynamically aligning lenses in ADAS cameras.

Renishaw's RenAM 500 Ultra laser powder bed fusion (LPBF) 3-D printer incorporates new scanning algorithms that allow the laser to fire while the recoater is moving, saving up to nine seconds per build layer.

Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.

AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.