Inspect-X 4.1 acquisition and analysis software for x-ray and CT systems provides improved real-time imaging and advanced BGA analysis. Real-time image enhancements provide easy-to-interpret images for fast online defect recognition. Image processing algorithms enable automated BGA analysis and reporting for stacked components and multilayer boards. Intelligently adapts to changing x-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide clear, sharp images to aid in defect recognition. Enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences. New BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as package-on-package (PoP) or dual-layered boards. Features a user-friendly template creation GUI of each BGA package, detailing array dimensions, positions and geometries using a wizard or directly imported from file. Automatically inspects each ball using advanced void analysis featuring single and total void percentage per ball. Also checks ball count, circularity, under- or oversizing, bridging and misalignment defects. Built-in reporting features overlay the x-ray images with color-coded analysis for easy interpretation. Is for large batch inspection; can inspect multiple boards in one routine.

Nikon Metrology, www.nikonmetrology.com

3D sensing capabilities incorporate multi-reflection suppression technology and 3D algorithms. Enable high-quality 3D images at production speeds, using multi-view sensors. Multi-view 3D data are merged with algorithms and MRS that suppress reflection that can distort data. Sensor design captures and transmits data simultaneously and in parallel.

CyberOptics Corp., www.cyberoptics.com

XQuik combines x-ray imaging with AccuCount Technology image processing and inventory management to provide accurate counts of components stored in tape-and-reel. Is said to automatically completes the count of components as small as 01005 with better than 99% accuracy in seconds. Works without having to remove reels from moisture barrier or anti-static bags. Benchtop system with a footprint of 26 x 24" (66 x 62cm). Barcode reading, automatic label printing and MES system interface options available.

VJ Electronix, http://vjt.com/vje/vje/

TrueHeight Spacer Blocks non-collapse disc spacers are said to improve yields of assemblies with large BGA devices. Enables reflow soldering of some types of through-hole devices. Are said to mitigate corner solder bridging caused by BGA warping during SMT reflow. Come in tape-and-reel packaging for automatic placement. Aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components by raising the component off the PCB, permitting solder to reflow freely to achieve 100% hole fill.  Height control + 0.010mm.

Alpha, www.alpha.alent.com

Bi rework solder paste is designed for desoldering Pb-free components and for LED removal. Reduces risk of board damage during desoldering. With desoldering temp. of 180°C, it reduces desoldering temperatures and times. Is a no-clean, halide-free flux. Features easy dispensing and cleanup. Provides excellent removal of through-hole and SMT components. Is RoHS compliant.

The Balver Zinn Group, www.balverzinn.com

BP 256 solder joint encapsulant is for BGA, CSP, flip-chip, PoP, and other ball bumping applications. Is said to create a solder joint bond five to 10 times stronger than a conventional solder joint, enhancing reliability and eliminating cracking. For use in lead-free, SnPb and SnBi processes. Reworkable.

Yincae, http://www.yincae.com/technical-information.html 

iFlex T2 surface mount machine can place component heights up to 21mm. Includes tray and tube feeding capability. Is designed for high mix environments. Reportedly achieves first-pass yield production levels with defect levels of less than 1dpm.

Assembléon, www.assembleon.com

Quad 01005 ceramic nozzles enable placement for 0201 and 01005 micro-components. Measure 0.32mm OD with a 1mm ID.

Count On Tools, www.cotinc.com

Optymo 4.2 software is intended to help with design choices, component management, purchasing and inventory management. Reportedly simplifies workflow between design and operations. Offers three packages: Optymo Design, Optymo Essentials, and Optymo Advanced. Includes graphical exploration based on basic components; revision control for components; copy/paste function within and between applications; online help and application notes, and an export module of configurable data. Offers a tree view of component categories and subcategories.

Inlynk, www.inlynksoft.com

WR5000M, WR3000TS, WR3000SS, WR3000TA and WR3000SA rework systems offer application flexibility, productivity and process control, including 400W of power over three independently-controlled channels, up to 21 tool options, up to 200W of soldering power and hot air power, and up to 120W of desoldering power for ground plane and multilayer boards. Comes with all critical components and tips. Less than 5 sec. hot air time to temperature. No end of cycle hot air cool-down time. Tool air flow volume of 1-15 L/min. Rotary vane vacuum pump. PC connectivity and data logging capabilities. Temperature stability of ± 2°C / ± 4°F. ESD-safe, meets or exceeds MIL-STD and J-STD-001E industry specifications. 

Weller, Apex Tool Group, www.weller-tools.com

DataMan 8600 series of handheld direct part mark barcode readers combine novel algorithms and patented UltraLight technology for reading DPM codes on a range of materials and surfaces. Provide Ethernet communication with industrial protocols, enabling integration with factory automation equipment. Field-interchangeable communication modules permit readers to be configured to meet customer-specific communication requirements. Come with both corded and wireless communication modules. Supports industry-standard communications including USB, RS-232 and Bluetooth wireless communication to an intelligent base station.

Cognex, www.cognex.com/handheld-barcode-scanners.aspx 

25X Measuring Microscope Pen is a pocket-sized microscope with measuring reticle for precision measurements. Is for inspecting defects and measuring conductor and pad widths, plated holes, and other tiny features and components on circuit boards. Field of view is 3.3 mm, with a scale division of 0.05 mm.

CircuitMedic, www.circuitmedic.com/parts/115-3115.shtml