LumenX v. 1.6 programmer reportedly delivers better download performance and establishes support for the latest generation of microcontroller (MCU) architectures.

Loctite Eccobond UF 1173 protective underfill material doesn’t contain any reportable REACH SVHCs, is not CMR classified and reportedly performs under high operating temperature environments.

Costimator 2019 cost estimating software supports estimating of hundreds of different manufacturing processes, including all forms of machining, fabrication, assembly, molding, castings, forgings and electronics.

Schroff Conduction Cooled Assembly (CCA) is designed to retain and cool printed circuit boards in environments where convection cooling cannot be used.

PrinTEK Pro MP-1818-V is designed for SMT printing.

Temprobe nondestructive temperature sensing technology is a measurement tool used primarily for high-value assemblies.

Master Bond UV26 is a one-part UV curable system featuring glass transition temperature ranging from 160° to 170°C.

AccuFlux BTC-578 solder preforms enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC).

E10-101 two-part pure silver-filled electrically conductive epoxy has sealing applications that use fine electrical and mechanical properties.

CX series USB 3.1 Gen2 Type-C connectors offer high current performance, waterproof certification and vertical orientation for enhanced design flexibility.

λ-Bridge (Lambda-Bridge) series thermal conductors are constructed with aluminum nitride or beryllium oxide materials.

FH-Series vision system can automatically detect small defects and subtle changes in color.