News
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, is planning several meetings at IPC SMEMA Council's APEX conference on Feb. 23-26, in Anaheim, CA. Several projects will be reporting on activities in conference sessions; the recently formed RoHS Transition initiatives will hold meetings to discuss areas of focus, objectives and activities; and several of the roadmap Technology Working Groups (TWGs) will begin discussions for the 2004 NEMI Roadmap.
NEMI's Defects per Million Opportunities (DPMO) Project will be featured as one of the APEX free forums on Feb. 25. The project is nearing completion of its investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on particular printed circuit board (PCB) assemblies, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also to estimate shipped product quality levels. During the forum, the DPMO Project team will present findings from their study, briefly review methodology, share lessons learned and discuss their vision for follow-on DPMO efforts in the industry.
Several of NEMI's optoelectronics projects will be discussed in conference sessions. Reports from the Fiber Optic Splice Improvement Project and the Optoelectronic Substrate Cost/Performance Analysis Project are featured in a panel on optoelectronics on Feb. 26. A third optoelectronic project—the Fiber Optical Signal Performance team—has a paper session scheduled on the show floor on Feb. 26 to discuss their paper, "Degradation of Optical Performance of Fiber Optic Connectors in a Manufacturing Environment."
Several of the roadmap TWGs are holding their initial organizational meetings. The TWGs are responsible for development of roadmap chapters on specific topics and are actively recruiting industry participants. Board Assembly, Environmentally Conscious Electronics and Interconnect Substrates—Organic are all scheduled to meet at APEX.
The RoHS Transition Task Group and four initiatives organized under this group will also hold meetings that are open to non-members. These efforts were organized in late 2003 in response to findings of the 2002 NEMI Roadmap, which highlighted the need for standards for collection, documentation and transmittal of material content data of components, assemblies and systems to meet the requirements of pending regulations. The group addresses supply chain issues surrounding the transition of the electronics industry to lead-free assembly. The meeting on Feb. 26 will provide an overview of group activities and include presentations from all of the working projects as well as a panel discussion with a question and answer session.
NEMI's Board Assembly & Substrates Technology Integration Groups (TIGs) have scheduled a joint "call for participation" meeting on Feb. 24 to launch two new collaborative efforts: materials and processes for high-frequency products; and substrate surface finishes for lead-free assembly
For a complete schedule of meetings, visit http://www.nemi.org/APEXmtgs_public.pdf.
Copyright 2004, UP Media Group. All rights reserved.
Kester (Des Plaines, IL) is working with BTU International (North Billerica, MA) to co-host a seminar focusing on lead-free technology. The seminar is scheduled for Tuesday, Feb. 10 in Tampa Bay, FL.
This series of seminars is part of the Kester University, which offers complete solder technology training programs coupled with consulting services to assist the electronics industry with training and process issues. Training courses are offered for surface-mount assembly, wave soldering and rework. Each course also offers technical and practical information for implementing lead-free assembly, wave and rework.
Courses in traditional leaded solder processes are available and are offered in both English and Spanish. The courses are customizable to accommodate a customer's need for in-house training of operators, line supervisors and managers. Courses come with complete in-class training materials and CD training modules.
This series of seminars is part of the Kester University, which offers solder technology training programs coupled with consulting services to assist the electronics industry with training and process issues. For information, contact: kesteruniversity@kester.com or call (847) 297-1600.
The Lead-Free Solutions seminar is co-produced by Kester, a supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail and wholesale plumbing markets, as well as by BTU International, a supplier of advanced thermal processing equipment for semiconductor packaging, surface mount and advanced materials processing.
Copyright 2004, UP Media Group. All rights reserved.
Samsung Electronics Mechatronics Center (Suwon City, Korea) has given ASC International (Maple Plain, MN) sales and service responsibilities for their line of FARA-VSS Series automatic optical inspection (AOI) equipment in the North America. Founded in 1992, ASC International has grown as a supplier of AOI for 3-D solder paste measurement.
"The Samsung brand name has a reputation for providing reliable, feature-rich products at affordable prices," said Jon Arneson, president of ASC International. "Samsung's AOI products are no exception, and align very nicely with ASC's product strategy. Samsung provides a total solution for surface-mount inspection with post-paste, pre- and post- reflow inspection systems and have been very successful in Asia and Europe. We think the timing for right for North America, given the recent market turnaround."
At APEX 2004 in Anaheim, CA (Feb. 24-26), ASC will introduce Samsung's latest model, the VSS-3EL to the North American market. The color camera-based system provides high speed and high resolution with the capability of inspecting 0201s. In addition, options such as repair software, SPC software and line monitoring software help take the guesswork out of inspection data interpretation.
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments (Binghamton, NY) and Hitachi High Technologies (HHT, Schaumburg, IL) have renewed their successful original equipment manufacturer (OEM) agreement for a further five years. HHT acquired Sanyo High Technologies, Universal's original OEM partner, in 2003. The partnership has enhanced Universal's turret-style high-speed placement (HSP) technology while affording HHT an extensive sales and support network.
Since it was first announced in 1989, the agreement has resulted in more than 1200 HSP platforms sold. Continued success of the partnership and sustained market demand for HSP equipment have allowed the agreement to be renewed several times in the past.
In addition to customers' access to the entire line of 4797-series HSP machines, extending the agreement until 2009 will allow further joint efforts to continue. Such efforts include recent line software development work and may extend in the future to additional joint technical projects, technology transfers and further product sharing.
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), an electronics contract manufacturer and printed circuit board (PCB) fabricator, has become the first company to enter a world-wide licensing agreement under Nortel Networks' Channel Routing technology licensing program, authorizing it to design and manufacture PCBs using Nortel Networks' patented technology.
Channel Routing allows designers the opportunity to improve the routability of signals out of dense array packages and potentially reduce the number of layers required to interconnect components. It is an algorithm that utilizes blind vias and/or microvias to open up routing channels in dense array packages allowing for improved wiring density. A software layout tool works with Sanmina-SCI's current ECAD tool to allow for auto-routing of designs with high I/O array packages, such as ball grid arrays (BGAs), speeding up the design process.
George Dudnikov, senior vice president and chief technology officer of Sanmina-SCI's PCB Division, said, " This is an opportunity for us to license someone else's innovation and provide products and services which utilize this licensed technology to all of our customers in addition to Nortel Networks. It also demonstrates a close collaboration between an original equipment manufacturer (OEM) and EMS partner in developing and commercializing new technology."
"By using our patented Channel Routing technology, complex PCBs can be designed with fewer layers, thereby enabling even higher density products, improved manufacturing yields, and overall, a more cost effective PCB," said Ryan Stark, vice president, Advanced Technology Investments, Nortel Networks. "Channel Routing will benefit those who are pushing the envelope in complex PCB design."
With this license, Sanmina-SCI is immediately able to offer Channel Routing to all of its board layout and PCB customers.
Copyright 2004, UP Media Group. All rights reserved.
AIM (Montreal, Canada) has announced an all day lead-free seminar to take place in Sydney, Autralia, on March 23, 2004. Future workshops are being planned at various locations worldwide.
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to quality, must have a solid understanding of the changes required of them.
While there are many theoretical workshops on lead-free assembly, this seminar focuses on the practical considerations for achieving successful lead-free assembly at a factory. Each step of the manufacturing cycle is addressed, from purchasing parts to inspecting assembled board.
Some of the lead-free assembly topics to be presented include: the status of lead-free legislation, marketing and implementation worldwide; reasons for hesitating to move towards lead-free soldering; design, component flux and solder alloy considerations; lead-free alloy requirements and materials management issues.
The instructor of the workshop is Karl Seelig, vice president of technology of AIM. In his 25 years of industry experience, Seelig has authored over 20 published articles on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection and metallurgical studies. Seelig has numerous awards and patents in soldering technology—including four for lead-free solder alloys—and has been one of the key developers of no-clean technology.
To participate, contact AIM Products Australia: (02) 47356775, or email: tweber@aimsolder.com.au.
Copyright 2004, UP Media Group. All rights reserved.
A supplier of electronic assembly machinery, Panasonic Factory Automation (PFA, Elgin, IL) has introduced a new offering—Solutions. The primary goal of the program is to demonstrate the benefits of customers partnering with their original equipment manufacturers (OEMs).
"Solutions was developed to globally share methods to increase customer's profit, performance and possibilities," said John Worthylake, PFA solutions and development manager. "Insight from customer suggestions and challenges—coupled with Matsushita's own manufacturing experience—has successfully provided solutions that simultaneously increase throughput, decrease costs and maximize the full potential of PFA's products."
Specifically, Solutions offerings include enhancements (a white L.E.D. Fiducial Light kit and a wide angle PCB detection sensor upgrade); equipment maintenance; spare parts options (cost-saving reversible tape cutter blades, remanufactured placement head assemblies); tools and jigs and training.
Copyright 2004, UP Media Group. All rights reserved.
Tamura F.A. System Corp. (Beaverton, OR), a company that develops and supplies the materials, components and products demanded by electronics markets, has announced the availability of a new lead-free system featuring solder bath technology designed for the electronics assembly industry.
FLIP Solder Bath for Lead-free Wave Soldering Solutions features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, per Fleming's left hand law. The force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils.
Additionally, the solder bath features advantages over other solder bath systems, including the use of less solder (300 kg, instead of 450 kg) and less solder dross (7 kg, instead of 15 kg) after 8 hours of operation. It also offers open space to access the inside side bath and easier nozzle cleaning and maintenance. It also features a quieter and more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated.
Copyright 2004, UP Media Group. All rights reserved.
Genesis Electronics Manufacturing Inc. (GEM, Tampa, FL) has transitioned its operations to a Tampa, FL, facility acquired in July 2003 from Jabil Global Services. GEM is a medium-volume, high-response electronics manufacturing services (EMS) provider.
In addition to nearly doubling GEM's physical space, the 50,000 sq. ft. facility expands the company's customer service offerings in the areas of equipment repair and service, specifically in the rebuilding of monitors, keyboards and telecommunications equipment. Test, repair and refurbishment equipment were acquired along with the facility and GEM added 15 new employees to cover its new areas of service.
"By growing our team, our physical space and our equipment, GEM has the ability to fulfill the demands of this service contract and extend like services to existing and new accounts," said GEM president Robert Stoller.
The expanded offerings bring GEM closer to its goal of providing services similar to those provided by tier-one suppliers. "While our customer base is generally not considered to be the market of the tier-one suppliers, we want to offer our customers the gamut of services they need to market their products, and equipment repair and service is considered the last stage of product life management," Stoller said. "GEM looks forward to providing a domestic option to customers who desire to have their product built in the USA."
The company can now be reached at:
14201 McCormick Drive
Tampa, FL 33626
(813) 854-1661
Copyright 2004, UP Media Group. All rights reserved.
BTU International Inc. (North Billerica, MA), a supplier of advanced thermal processing equipment for semiconductor packaging, surface-mount and advanced materials processing, has announced the appointment of Tom Nash as vice president of marketing.
Nash joins the company as a member of the senior management team, reporting directly to Mark R. Rosenzweig, president and chief executive of BTU International. Nash will oversee all facets of corporate marketing, working closely with the executive team on corporate strategy as the company continues to expand its product and customer base.
"We are extremely pleased that Tom has joined our team," said Rosenzweig. "He brings a wealth of international business experience in the electronics and process control industries as well as valuable experience in strategic planning, acquisition analysis and new business development. Tom will utilize his skills and experience to guide our new product development program, implement strategies to increase our global market share and support our worldwide sales organization."
Nash has previously held positions in general management, executive sales and marketing management, as well as product development, during his career at the Black & Decker Corp., Vitronics Corp. and most recently as president of CIMCIS Ltd.
Copyright 2004, UP Media Group. All rights reserved.
SEICA Inc. (Methuen, MA), a provider of electronics testing and production solutions, will further enhance its support network in North America with the opening of a sales and support office in Santa Clara, CA. At a time when many of its competitors are dedicating their resources to the Asian market, Seica plans to provide a high level of support in any geography where it has customers needing services.
Having set up an office near Boston in 2003 to serve the East coast, the new West coast office will provide local support for new and existing customers and have sales and demonstration capabilities for the company's S24 Backplane, S40 Pilot, ICT and Functional test products.
Seica was the first European company to develop and manufacture a flying probe tester for loaded boards, a platform that has been sold globally by Teradyne (and previously by GenRad). With its latest flying probe and other test technologies, Seica has emerged as a supplier of test technologies and is now backing its products with the support expected of a global player in the electronics industry.
Copyright 2004, UP Media Group. All rights reserved.
At DesignCon 2004, Winchester Electronics and Interconnect Technologies, business units of Northrop Grumman Corp. (Los Angeles, CA), and Xilinx Inc. (San Jose, CA) demonstrated the world's first implementation of a fully functioning 10 Gbps backplane reference design, manufactured using Winchester's SIP1000 I-Platform Passive Interconnect Technology, Interconnect Technologies' printed circuit board design and fabrication expertise and Xilinx Virtex-II Pro X field programmable gate arrys (FPGAs), and tested using Agilent 10 Gbps test and measurement equipment. Consistent with the input/output technology detailed in the UXPi standard, the companies demonstrated that 10 Gbps backplanes can be manufactured with off-the-shelf products and services available today.
"The inherent scalability and cost advantages of high-speed serial make this technology imperative for current and next-generation telecommunications, networking and storage applications," said Erich Goetting, vice president and general manager of the Advanced Product Group at Xilinx. "Today's demonstration proves that technology continues to push the envelope; backplanes can be built today that support 5G, 6.25G and 10G serial rates, allowing tomorrow's backplanes to be built and deployed today."
Michael P. Driscoll, president, Winchester Electronics, said, "The passive channel technology we are demonstrating at DesignCon 2004 will serve as a solid base upon which transceiver technologies for data rates of 20 Gbps and beyond will be built.The days of just selling connectors and printed circuit boards are gone and the days of selling channels have arrived. The reference design demonstrated proves that 10 Gbps in copper is a reality today."
The platform is a true interconnect platform designed to enable 10 Gbps+ serial data transmission in copper backplanes without the need for active equalization techniques. Conceived as a passive system-level interconnect, the platform seeks to reset the balance between the passive and active elements in what have become known as active interconnect systems by delivering a revolutionary new interconnect technology architecture that provides solutions for ultra high-speed, high-density differential applications.
Northrop Grumman Winchester Electronics is a provider of high-speed, high-bandwidth interconnect products, including board-to-board connectors, RF connectors, cable assemblies and power interconnects. Northrop Grumman Interconnect Technologies designs and manufactures electrical and electro-optical printed circuit boards and backpanel assemblies.
The announcement represents a major milestone in the Xilinx Serial Tsunami initiative, designed to accelerate the industry move from parallel to serial I/O technology by delivering next-generation connectivity solutions that meet bandwidth requirements from 3.125 Gbps today to 10.3125 Gbps and beyond.
Copyright 2004, UP Media Group. All rights reserved.
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