News
ATLANTA, GA – Georgia Tech researchers have developed a new technique for cooling high-performance integrated circuits, using microchannels integrated onto the backs of circuits to carry cooling water. The technology could allow denser packaging of chips while providing better temperature control and improved reliability.
The technique includes polymer pipes that will allow electronic and cooling interconnections to be made simultaneously using automated manufacturing processes, without damage to ICs.
“This scheme offers a simple and compact solution to transfer cooling liquid directly into a gigascale integrated (GSI) chip, and is fully compatible with conventional flip-chip packaging,” said Bing Dang, a Graduate research assistant in Georgia Tech’s
The approach allows a simple monolithic fabrication of cooling channels directly onto ICs using a CMOS-compatible technique at temperatures of less than 260°C.
In addition to the cooling channels, the researchers have built through-chip holes and polymer pipes that allow the on-chip cooling system to be connected to embedded fluidic channels built into a printed wiring board. The channels can be connected at the same time the IC is connected electronically – using flip-chip bonding – and can withstand pressure of more than 35 pounds per square inch.
The system should be able to cool 100 watts per square centimeter.
Dang expects the technology to be used first in high-performance specialty processors that can justify the cost of the cooling system. So far, the researchers have demonstrated continuous liquid flow on a chip for several hours without failure, but additional testing is still needed to confirm long-term reliability, he added.
By eliminating the large heat sinks and heat spreaders, along with high-aspect ratio fins, the technology could allow denser packaging of integrated circuits, making 3-D packaging feasible.
The technique was presented in June at the IEEE International Interconnect Conference, and a paper will be published next month in the proceedings of ASME InterPACK. The research was sponsored by the Microelectronics Advanced Research Corp. and the Defense Advanced Research Projects Agency (DARPA).
San Clemente, CA -- YESTech has opened a Singapore office to provide sales, training and technical support to its South East Asia customer base.
The office will provide training and sales for the YTV Series of automated optical inspection (AOI) systems and YTX Series of x-ray inspection systems. The company claims these yield enhancement solutions lower board failure rates and insure a high quality product.
FRAMINGHAM, MA – Investment in IT is beginning to show signs of life, a new study found, based on a survey of over 200 financial institutions.
Financial Insights, an IDC company, estimates that North American capital markets firms are planning to spend a total of $36 billion on technology in 2005 based on current budgets and plans. The firm forecast 5% growth in IT capital buys for the industry.
DALLAS -- Jack Kilby, whose invented the integrated circuit in 1958 and later shared in the Nobel Prize, died Monday of cancer. He was 81.
At Texas Instruments in 1958, Kilby built the first IC into a single piece of semiconducting material half the size of a paper clip. Kilby also co-invented the handheld electronic calculator that made TI a household name.
TORONTO -- SMTC Corp. will build assemblies for Leitch Technology in a deal worth an estimated annualized run rate of $20 million.
SMTC will provide electronics manufacturing services for Leitch, a maker of high-end video systems.
Under the terms of the agreement, SMTC will initially provide complete manufacturing services to Leitch at its new product introduction center in Markham, Ontario, and its facility in Chihuahua, Mexico.
In a statement, SMTC senior vice president of business development Steve Hoffrogge said the "transition ... is well underway, with full roll out of the initial phases expected in the third and fourth quarters of the year."
RICHARDSON, TX – Michael C. Shores, president and chief executive of TXP-Texas Prototypes Inc, was named a finalist for Ernst & Young's Entrepreneur of the Year 2005.
The E&Y program recognizes significant business achievements around the world made possible by the entrepreneurial spirit.
Shores, who writes a column on optoelectronics assembly for Circuits Assembly, is a finalist in the Realizing Business Potential category for the Southwest.
Shores was selected by an independent panel of judges comprised of local business, academic and community leaders.
TXP provides prototyping electronics manufacturing services. It was
“The acceptance of our business model has been overwhelming,” said
ST. PETERSBURG, FL – Jabil Circuit reported third-quarter profit climbed 48% on a 19% hike in sales. The top tier provider of electronics manufacturing services said May quarter earnings rose to $59.4 million, from $40.1 million a year ago.
Revenue rose 19% to $1.94 billion from $1.63 billion last year.
RENO, NV -- Electronic Evolution Technologies, a manufacturer of assemblies for the medical, RF/wireless, gaming, industrial and digital AV markets, will assume a 17,000 sq. ft. plant in Empalme, Sonora, Mexico.
The plant is located in the Bellavista Industrial Park and is run by the Offshore Group, a Tucson, AZ, provider of outsourced manufacturing services to companies in the aerospace, medical device, automotive, electronics and optics industries in Mexico.
EET will eventually employ between 50 to 100 direct labor workers, the company said.
In a statement EET president Sonny Newman said, "Our decision to establish an operation in Mexico was predicated on a desire to offer our customers a low-cost labor solution."
The Offshore Group runs industrial parks in Coahuila and Sonora and claims more than 35 manufacturers under contract that employ an aggregate 13,500 direct labor employees.
ROCHESTER, NY ¾ Hover-Davis Inc., designer and manufacturer of component delivery systems for the PCB assembly industry, has appointed Sincotron Finland Oy as its distributor for Finland and the Baltic States.
Sincotron Finland is a distributor of machines, material and services, including SMD placement, inspection, microelectronics (such as bonding, curing and cleaning), soldering, dispensing, screen printing, testing, software, profiling, tools and consumables (such as solder paste and stencil wiper papers).
“Sincotron is well established and respected in the Finnish market,” said Mike Hayward, H-D European sales manager. “Their line card is complimentary to the Hover-Davis product offering and plans for expansion into the Baltic States means that we can extend our coverage into these emerging markets.”
Norwalk, CT- Technology software developer BDMetrics will debut ATExpo Connects, a personalized web-based tool, at the Assembly Technology Expo in September. Available for each show attendee, the software mines through the ATExpo database of people, products and conference sessions to generate a custom report tailored to the attendees' needs and interests.
The tool will be release in mid-August. After attendees register, they will be emailed a personalized report detailing people they should meet, companies they should visit and conference sessions they should attend, based on the preference each attendee outlines when they register. The report will be updated as the show dates approach.
ATExpo will take place Sept. 27-29, at the Donald E. Stephens Convention Center in Rosemont, IL.
“This is an important first step in fulfilling the evolving needs of OEM and
JACKSON, MI -- Sparton Corp., a provider of electronics manufacturing services, said today that it will no longer pursue negotiations to acquire medical device manufacturer HDJ Co. and its wholly owned subsidiary, Specialized Medical Devices Inc.
The company did not disclose a reason for the decision.
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