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Clinton, NY -- Indium Corp.’s senior technologist, Dr. Ronald C. Lasky, Ph.D., and Pb-free program manager, Tim Jensen, will present at an SMTA workshop on March 21, in Milpitas, CA. The courses will be “A Protocol for WEEE and RoHS Compliance” and “Best Practices in Implementing PB-Free Assembly: 2006”.
 
Dr. Lasky will also focus on implementing Pb-Free electronics assembly at two additional upcoming conferences:
March 27 at PCB West in Santa Clara, CA
March 29 at SMTA Canada in Toronto
 
At PCB West, Dr. Lasky’s topic will be: “Best Practices in Implementing Lead-Free Assembly, Part 1 and Part 2.” The workshop will focus on how to implement lead-free including PCB finishes, components, alloys and SMT processes. Actual implementation of lead-free processes will be discussed as well as current legislation and practices.
 
At SMTA Canada, the topic will be “Rapid Implementation of Lead-Free and RoHS Compliant Assembly, Declaration and Documentation.” This workshop will provide the information, tools and resources to develop and execute a plan for rapid WEEE and RoHS compliance.
SAN JOSE – North American-based manufacturers of semiconductor equipment posted $1.3 billion in orders in February on a three-month average basis and a book-to-bill ratio of 1.01 according to SEMI.

A book-to-bill of 1.01 means that $101 worth of orders were received for every $100 of product billed for the month.

Bookings were almost 6% higher than revised January levels and almost 27% higher year-over-year.

The three-month average of worldwide billings in February 2006 was $1.29 billion.

Billings grew 2% over revised January levels but fell 3% versus February 2005.

"Increasing booking and billing levels over the past quarter are indicative of healthy growth, as companies are investing more dollars in technology and capacity," said Stanley T. Myers, president and CEO. "The book-to-bill has hit parity for the first time since August 2004, so we are optimistic about growth in the equipment market for 2006."

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
SAN FRANCISCO – Fabrinet, a leading EMS provider, has received TL 9000QMS certification for manufacturing of electronic assemblies and optical devices.

Fabrinet gained certification for its campuses near Bangkok, where Fabrinet has over 500,000 sq. ft. of manufacturing space and over 4500 employees.

“Receiving TL9000 certification represents a culmination of our efforts to make Fabrinet a world-class manufacturing outsourcing destination for companies throughout the telecommunications spectrum, from component vendors to system vendors,” said Tom Mitchell, chairman and CEO of Fabrinet.

“Being TL 9000 certified means that Fabrinet can now meet the quality requirements of the worldwide telecommunications industry.”

TL 9000 defines quality system requirements for design, development, production, delivery, installation, and maintenance of telecom products and services.

MANKATO, MN -- EMS provider Winland Electronics Inc. has signed a new three-year agreement with Select Comfort Corp.

Winland will manufacture about half of the electronics assemblies for Select Comfort's Sleep Number adjustable-firmness bed. Winland will also remain the exclusive supplier of all products it manufactures for Plymouth-based Select Comfort through at least June 30.

The new agreement replaces a previous agreement that was set to expire in August. Winland has revised its prices and will see a lower margin as a result.


ST. PETERSBURG, FL -- Jabil Circuit Inc. on Wednesday reported a 50% jump in profit for its fiscal second quarter.

For quarter ended Feb. 28, the EMS provider reported profits of $69 million on a 35% spike in revenue, to $2.3 billion.  Read more ...

SEATTLE -- Microsoft will increase supplies of its Xbox 360 games console to retailers by two to three times, beginning this week.

The company, which due to component shortages has struggled with production of the popular device, has lowered its target to 4.5 million to 5.5 million units to be shipped by June.

The component situation has been resolved, the company said.

Microsoft outsources production of the consoles to Wistron, Flextronics and Celestica.

SAN JOSE -- Verigy Pte. Ltd., the ATE branch of Agilent which is on track to be spun off,  will outsource its manufacturing to Flextronics beginning later this year.

The plan was detailed in a S-1 filing required as part of Verigy's proposed initial public offering.
Read more ...
NEW YORK -- IBM has signed a long-term contract with Solectron Corp. to manage billions of dollars in indirect procurement services across 17 countries. Other terms of the contract were not disclosed.

Under the contract, IBM will manage more than $1.2 billion per year of indirect spend for temporary contract services, office equipment, utilities and telecommunications. IBM will integrate its procurement software with Solectron's internal systems and controls.

IBM will enable Web-based requisitioning as well as efficient procurement and supplier payment.

"The savings we expect from this contract with IBM will contribute to both operational and process innovation and simplification, which improves services to our customers and suppliers," says Perry Mulligan, chief procurement officer, Solectron, in a prepared statement.

IBM will supply commodity experts, a global contact center and an accounts payable processing center supporting Solectron suppliers and employees around the globe. Solectron will also have access to a full range of transformation and maintenance services from IBM.
SAN JOSE -- The Semiconductor Industry Association today launched a new website on America’s competitiveness. The site is the latest in a series of activities designed to focus attention on steps to take to ensure American leadership in innovation and technology.

The site, located at www.choosetocompete.org, details the industry’s importance to the everyday life of Americans and the need for public policies that foster a competitive economic environment for Information Technology industries.

“For more than 50 years, America has been the world leader in innovation and technology,” said SIA president George Scalise. “Leadership in innovation and technology has been essential to continuous improvements in the U.S. standard of living, increased productivity and higher wages for American workers, and ensuring national security. Today other nations are working very hard to replicate our model for success. This Website presents a series of broadly supported public policy initiatives designed to meet the new global competitive challenge and secure America’s leadership in technology and innovation.”

The site includes information showing the importance of increased federal support for basic research at U.S. universities, updated education and immigration policies that will allow American companies to maintain employment within its borders, and economic policies that enhance the climate for investment in high-tech facilities for manufacturing, research and development, and product design.

Other areas of the site provide information on critical applications of chip technology – from agriculture to medical science and national defense. The site also features news updates on the growing momentum for action on bipartisan proposals on American competitiveness, information on proposed legislation and links to partner Websites.

In April SIA will add an interactive tool outlining the key points in the modern technology timeline, illustrating the critical role of semiconductors in a broad range of applications, and presenting the challenges now faced by America’s technology sector.
Rome, NY – The ESD Association has scheduled an ESD Device/Design Seminar to be held at its Rome headquarters May 1-2. Developed by the ESDA’s Professional Education Committee, the technical seminar will cover on-chip ESD protection designs.
 
The seminar will focus on: ESD in the industrial semiconductor IC context; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements, including RF, and their impact on ESD; CDM ESD protection; and design examples and case studies.
 
The course is required for ESD Certified Professional-Device/Design certification.
 
Instructors are Charvaka Duvvury, Ph.D., Texas Instruments, and James W. Miller, Freescale.
 
For more information, visit esda.org/documents/DeviceDesignSeminar-2006_Rome.pdf
SEATTLE -- Microsoft has delayed -- again -- the launch of its Windows Vista operating system, pushing out the next generation software for PC consumers to January 2007. Business customers will get in the door a couple months earlier, in November.

Analysts are mixed on whether the delay will impact overall PC sales, but the consensus is that buyers will wait the extra few months for the new OS. Thus, fourth quarter shipments might not be as robust as previously forecast.  Read more ...

HERNDON, VARegistrations for iNEMI’s April 5 roadmap workshop are due March 28, the consortium said today.

The full-day meeting, co-sponsored by Fraunhofer IZM, IEEE’s CPMT (Components, Packaging and Manufacturing Technology) Society and IMAPS Europe, takes place at the ICM Congress Hall at Munich Messe. 

It coincides with SemiCon Europa, also in Munich.

The workshop will give attendees an advance review of draft chapters of the 2007 iNEMI Roadmap, including two key market segments and eight of the 19 technology and infrastructure areas covered:

Product sectors include automotive products and consumer/portable products. Technology areas include Packaging, board assembly, organic substrates, ceramic substrates, sensors, test, inspection and measurement, final assembly and environmentally conscious electronics.

Attendees' input be be incorporated in the 2007 Roadmap.

The registration fee is $200 and includes a copy of the 2007 iNEMI Roadmap CD. Registration deadline is March 28.  For information click here.

For information about SemiCon Europa, click here.

Every two years iNEMI updates its compendium of future manufacturing technology needs of the global electronics industry. The roadmap has become recognized as an important tool for defining the state of the art in electronics as well as identifying emerging and disruptive technologies. 


Read more ...

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