News
OXFORDSHIRE, UK – The National Physical Laboratory will hold a meeting on copper dissolution in lead-free alloys on Dec. 7 in Oxfordshire.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
REDMOND, WA – Data I/O and Intel will offer an integrated solution to facilitate adoption and manufacturing with Intel’s flash memory devices and Data I/O’s automated programmers.
The companies will collaborate on concurrent engineering practices for cellular, consumer electronics, communications, computing and industrial applications, and will offer joint seminars and other educational forums. Data I/O will provide priority support for Intel customers, and work on technology development and licensing.
The companies will also explore collaborating on the Open NAND Flash Interface (ONFI) initiative to establish a standard interface for NAND flash memory devices.
The companies will collaborate on concurrent engineering practices for cellular, consumer electronics, communications, computing and industrial applications, and will offer joint seminars and other educational forums. Data I/O will provide priority support for Intel customers, and work on technology development and licensing.
The companies will also explore collaborating on the Open NAND Flash Interface (ONFI) initiative to establish a standard interface for NAND flash memory devices.
SAN JOSE -- Randy Furr, the CFO of Adobe Systems, resigned today, the company said in a press announcement. No reason was given for the departure, although Adobe said it was unrelated to Furr's performance or the company's financial statements.
Adobe is among the companies restating earnings due to improper dating of stock options. Adobe will restate earnings from 1997 to 2006.
Furr was president and COO of Sanmina-SCI from 1996 until he resigned October 2005.
Adobe is among the companies restating earnings due to improper dating of stock options. Adobe will restate earnings from 1997 to 2006.
Furr was president and COO of Sanmina-SCI from 1996 until he resigned October 2005.
HERNDON, VA – iNEMI’s SnPb BGA Availability Task Group has scheduled a workshop for OEMs and the BGA supply base to meet Jan. 24 in the San Jose, CA area.
The workshop will address the needs of OEMs taking the lead (Pb) exemption from the RoHS Directive. iNEMI reportedly will develop ways to work with the BGA component supply base to support SnPb-compatible BGAs, assist with questions of long-term reliability, and develop other solutions.
The group plans to create a list of critical BGA component families; estimate total available market (TAM) for these devices in SnPb assembly versions, and develop a general business case based on TAM.
Registration information is available at
http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html.
The workshop will address the needs of OEMs taking the lead (Pb) exemption from the RoHS Directive. iNEMI reportedly will develop ways to work with the BGA component supply base to support SnPb-compatible BGAs, assist with questions of long-term reliability, and develop other solutions.
The group plans to create a list of critical BGA component families; estimate total available market (TAM) for these devices in SnPb assembly versions, and develop a general business case based on TAM.
Registration information is available at
http://www.inemi.org/cms/projects/ese/SnPb_BGAs.html.
MUNICH - Siemens announced that its fourth-quarter profits rose eightfold, in part because of higher earnings in its automation units.
YAVNE, ISRAEL – Valor Computerized Systems reported third-quarter revenues of $9.2 million, flat with a year ago. The net profit rose 640% to $754,000 year-over-year. For the quarter, earnings before income taxes was $714,000, up from $68,000.
A call for papers has been issued for “The Trends and Future Requirements in Automotive Electronics,” an international symposium organized by Munich Trade Fairs International. In conjunction with electronica and ProductronicaChina, this event will be held Mar. 22 and 23 at the Shanghai New International Trade Fair Center.
Symposium topics are to include power train; sensors; fuel cell and hybrid; vehicle networks; electric power steering; infotainment, and simulation and test.
Abstracts should contain title of paper, author’s contact information, and between 250 to 400 words of text describing presentation.
Deadline for submitting topic proposals is Dec. 15. Send abstracts to epc1@mmi-shanghai.com.
Symposium topics are to include power train; sensors; fuel cell and hybrid; vehicle networks; electric power steering; infotainment, and simulation and test.
Abstracts should contain title of paper, author’s contact information, and between 250 to 400 words of text describing presentation.
Deadline for submitting topic proposals is Dec. 15. Send abstracts to epc1@mmi-shanghai.com.
NEW YORK – Illinois Tool Works Inc. continued its one-company consolidation spree, acquiring electronics manufacturing equipment supplier Speedline Technologies. Financial terms of the transaction were not disclosed and the deal is expected to be completed this quarter.
Speedline has been owned by KPS Special Situations Funds, a private equity group which bought the company from Cookson for roughly $10 million in 2003. Its brands include MPM, Electrovert, Accel and Camelot.
CIUDAD JUAREZ, MEXICO -- Flextronics has completed the first phase of its planned 1.9 million sq. ft. facility in here, the company said today.
The site, as previously reported by Circuits Assembly, will perform build-to-order services, electronics assembly, metal stamping, plastic injection, repair and distribution. It will employ 4,000 employees within five years, the company said.
The site, as previously reported by Circuits Assembly, will perform build-to-order services, electronics assembly, metal stamping, plastic injection, repair and distribution. It will employ 4,000 employees within five years, the company said.
TORONTO -- Electronics manufacturing services provider SMTC Corp. has expanded its San Jose footprint to accommodate more manufacturing and configure-to-order capacity, as part of its strategy on developing opportunities in the Western U.S. SMTC San Jose offers fully integrated manufacturing services ranging from assembly, testing, box-build to final product integration and customer logistics.
NEWARK, NY -- IEC Electronics' fourth-quarter revenue rose 95 % and net Income increased 577% over last year .
For the quarter ended Sept. 30, the EMS firm's revenues increased to $8.1 million, operating Income was up 671% to $447,000 (5.5% of sales), and net Income was $352,000.
It was the company's highest level of quarterly sales in over three years. Backlog is also at its highest point in three years. Since June the firm has added more than 100 employees.
W. Barry Gilbert, Chairman of the Board and CEO, said, "Barring unforeseen events we expect sales and profitability to continue to show quarterly improvements over the same period from the previous year. "
IEC has renegotiated its loan agreement with Keltic Financial LLC to increase borrowing capacity and to reduce associated borrowing costs.
For the quarter ended Sept. 30, the EMS firm's revenues increased to $8.1 million, operating Income was up 671% to $447,000 (5.5% of sales), and net Income was $352,000.
It was the company's highest level of quarterly sales in over three years. Backlog is also at its highest point in three years. Since June the firm has added more than 100 employees.
W. Barry Gilbert, Chairman of the Board and CEO, said, "Barring unforeseen events we expect sales and profitability to continue to show quarterly improvements over the same period from the previous year. "
IEC has renegotiated its loan agreement with Keltic Financial LLC to increase borrowing capacity and to reduce associated borrowing costs.
FORT WASHINGTON, PA — Kulicke & Soffa Industries Inc. today closed the previously announced purchase of die bonder equipment maker Alphasem.
K&S paid a $27.1 million in cash for the former Dover Technologies unit.
K&S chairman and chief executive Scott Kulicke said, “We had identified die bonding equipment as a natural growth path for K&S. The Alphasem purchase is the most attractive way for us to enter that market.
According to the most recent VLSI Research market data report, Alphasem held a 10% share of the $520 million die bonder market in calendar 2005. Alphasem had sales of approximately $60 million in 2005 for die bonders, related materials and services, and employs 260 workers.
K&S paid a $27.1 million in cash for the former Dover Technologies unit.
K&S chairman and chief executive Scott Kulicke said, “We had identified die bonding equipment as a natural growth path for K&S. The Alphasem purchase is the most attractive way for us to enter that market.
According to the most recent VLSI Research market data report, Alphasem held a 10% share of the $520 million die bonder market in calendar 2005. Alphasem had sales of approximately $60 million in 2005 for die bonders, related materials and services, and employs 260 workers.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin