News
SCOTTSDALE, AZ – Intel, Nan Ya, Foxconn and a host of other companies are scheduled to speak at a January symposium on halogen-free technology.
Mostafa Aghazadeh, Intel vice president and director of Chandler assembly technology development, and F.Y. Lee, vice president of Nan Ya materials, will keynote the conference.
Topics covered at the symposium will include OEM’s environmental positions and roadmaps, supply chain readiness, and challenges including material availability, cost and reliability.
Intel will host the symposium, which takes place Jan. 15–16, in Scottsdale. IPC is a co-producer.
Among the companies that plan to participate are Dell, HP, Apple, Lenovo, and the U.S. EPA.
To register: http://www.ipc.org/calendar/2008/intel_halogen_free/intel0108-REG.pdf
Mostafa Aghazadeh, Intel vice president and director of Chandler assembly technology development, and F.Y. Lee, vice president of Nan Ya materials, will keynote the conference.
Topics covered at the symposium will include OEM’s environmental positions and roadmaps, supply chain readiness, and challenges including material availability, cost and reliability.
Intel will host the symposium, which takes place Jan. 15–16, in Scottsdale. IPC is a co-producer.
Among the companies that plan to participate are Dell, HP, Apple, Lenovo, and the U.S. EPA.
To register: http://www.ipc.org/calendar/2008/intel_halogen_free/intel0108-REG.pdf
MINNEAPOLIS – The SMTA announced Bill Barthel of Plexus and Dr. Laura Turbini of Research in Motion were re-elected to three-year terms on the association’s board of directors. Bill will serve as VP of technical programs and Laura will continue to serve on the association’s planning committee.
Joe Belmonte of Bose Corp. and Marie Cole of IBM were elected to the planning committee.
Current directors include president David Raby of STI Electronics, VP communications Tom Forsythe of Kyzen; VP membership Jim Kuehn of Tyco Electronics Automation Group; treasurer Dan Baldwin of Engent, and secretary Irene Sterian of Celestia.
Other planning committee members include chairperson Steve Greathouse of Greathouse Solutions; Dr. Ning-Cheng Lee of Indium; and Dr. Denis Barbini of Vitronics-Soltec.
Joe Belmonte of Bose Corp. and Marie Cole of IBM were elected to the planning committee.
Current directors include president David Raby of STI Electronics, VP communications Tom Forsythe of Kyzen; VP membership Jim Kuehn of Tyco Electronics Automation Group; treasurer Dan Baldwin of Engent, and secretary Irene Sterian of Celestia.
Other planning committee members include chairperson Steve Greathouse of Greathouse Solutions; Dr. Ning-Cheng Lee of Indium; and Dr. Denis Barbini of Vitronics-Soltec.
BANGKOK – Top 40 EMS provider Fabrinet has filed a registration statement with the U.S. Securities and Exchange Commission for a proposed initial public offering of its ordinary shares.
ARLINGTON, VA – Electronic component orders dipped slightly in October after rising for four consecutive months, according to the Electronic Components, Assemblies and Materials Association.
The 12-month average, which compares order growth to the previous year, stayed level.
The modest downturn did not create alarm, especially since it was caused primarily by lower results in the first week of October, after which orders rebounded nicely through the end of the month, the ECA reports.
New cars, mobile phones, PDAs, TVs and other consumer items are packing in more components than ever, the ECA says. Sebastien Rospide of consulting firm Decision reported that the newest generation of flat-panel TVs incorporate between 2,500 to 3,000 passive components, while older-style CRTs use anywhere from 300 to 500. Rospide forecasts 8.5% growth in world electronics production this year, which will drive 6.5% growth for electronic components.
ATLANTA – UP Media Group, parent company of Circuits Assembly, announced today that several leading industry suppliers have signed on to exhibit at Virtual PCB, the industry’s first virtual trade show and conference for the PCB design, fabrication and assembly markets, Feb. 12-13.
Exhibiting companies to date include Agilent Technologies, BTU International, Dage Precision Industries Inc., DEK, and EFD.
PITTSBURGH – Plextronics Inc. has received investment capital from Applied Ventures LLC, the venture capital arm of Applied Materials Inc.
The funds will help Plextronics expand its product development and manufacturing capabilities, as well as increase its investment in sales and marketing activities.
Plextronics' device design, process technology and novel inks are used to form active electrical layers.
Plextronics has raised a total of $41 million in equity capital during the last five years, including $20.6 million in financing from a group of venture capital companies, and from the Sustainable Energy Fund of Central Eastern Pennsylvania.
SAN JOSE – A court hearing on alleged infringement of Tessera Technologies’ patents is now scheduled in late February.
The court date is the latest move in the U.S. International Trade Commission’s investigation regarding possible infringement of Tessera’s patents by Qualcomm, Freescale, Motorola, ATI Technologies, ULC, Spansion and ST Microelectronics.
On Sept. 7, Tessera filed with the ITC for permission to use certain confidential information to initiate a parallel action against several assembly service providers, including ASE, ChipMOS Technologies, Siliconware Precision Industries and STATS ChipPAC.
On Sept. 12, the providers filed a motion requesting the court stop Tessera from moving forward on the basis of the forum selection clauses in their respective Tessera license agreements.
Tessera’s ongoing arbitration with Amkor Technology regarding a failure to pay royalties due under its license agreement is proceeding toward a March 31 hearing. Tessera seeks a substantial monetary recovery from Amkor. Amkor has submitted an expert report contending that Tessera’s patents are invalid.
Tessera seeks remedies for infringement of its technology in two pending district court patent infringement actions, one in the Northern District of California and one in the Eastern District of Texas. Tessera’s right to recover damages against the California action defendants is expected to continue during the pending ITC action.
After a hearing on Nov. 1, the court issued an order permitting Tessera to file a complaint against the ASP defendants in the ITC or elsewhere.
In the Eastern District of Texas, the parties have stipulated the litigation will be temporarily stayed.
The court date is the latest move in the U.S. International Trade Commission’s investigation regarding possible infringement of Tessera’s patents by Qualcomm, Freescale, Motorola, ATI Technologies, ULC, Spansion and ST Microelectronics.
On Sept. 7, Tessera filed with the ITC for permission to use certain confidential information to initiate a parallel action against several assembly service providers, including ASE, ChipMOS Technologies, Siliconware Precision Industries and STATS ChipPAC.
On Sept. 12, the providers filed a motion requesting the court stop Tessera from moving forward on the basis of the forum selection clauses in their respective Tessera license agreements.
Tessera’s ongoing arbitration with Amkor Technology regarding a failure to pay royalties due under its license agreement is proceeding toward a March 31 hearing. Tessera seeks a substantial monetary recovery from Amkor. Amkor has submitted an expert report contending that Tessera’s patents are invalid.
Tessera seeks remedies for infringement of its technology in two pending district court patent infringement actions, one in the Northern District of California and one in the Eastern District of Texas. Tessera’s right to recover damages against the California action defendants is expected to continue during the pending ITC action.
After a hearing on Nov. 1, the court issued an order permitting Tessera to file a complaint against the ASP defendants in the ITC or elsewhere.
In the Eastern District of Texas, the parties have stipulated the litigation will be temporarily stayed.
BOSTON – Sales of backhaul transport equipment will grow 43% annually over the next five years, reaching $7.3 billion by 2012, says Ovum RHK.
Component demand related to backhaul transport equipment will exceed $1 billion by 2012, the company adds, citing a five-year forecast of wireless backhaul traffic, services, equipment and components.
Traffic on mobile backhaul networks will grow by 32% per year, driven by the adoption of mobile broadband services around the globe, and mobile operators will spend $37 billion globally on wireless backhaul in 2012, nearly 12% of total operating expense, Ovum says.
“Mobile operators today are challenged to grow backhaul capacity quickly, flexibly, and economically, to support rapid growth in bandwidth-intensive mobile data services,” said Ovum VP John Lively. “Fortunately, many new architectures and equipment innovations will allow them to meet this challenge."
Component demand related to backhaul transport equipment will exceed $1 billion by 2012, the company adds, citing a five-year forecast of wireless backhaul traffic, services, equipment and components.
Traffic on mobile backhaul networks will grow by 32% per year, driven by the adoption of mobile broadband services around the globe, and mobile operators will spend $37 billion globally on wireless backhaul in 2012, nearly 12% of total operating expense, Ovum says.
“Mobile operators today are challenged to grow backhaul capacity quickly, flexibly, and economically, to support rapid growth in bandwidth-intensive mobile data services,” said Ovum VP John Lively. “Fortunately, many new architectures and equipment innovations will allow them to meet this challenge."
JASPER, IN – Kimball International reported sales of $333.9 million in the first quarter of 2008, an increase of 7.2% year-over-year. Income from continuing operations was $6.6 million.
KUALA LUMPUR – Unisem, a maker of semiconductor test and packaging equipment, announced record revenue of $90.9 million for the third quarter, up 70.9% year-over-year. The company’s net profit ($9.23 million) grew 73.7% year-over-year.
Sequentially, sales were up 89%, while net profit increased 12%.
The significant upsurge in revenue was attributed to increased sales volume, revenue and profit contribution from Unisem Mauritius (formerly known as Advanced Interconnect Technologies Ltd.) after the acquisition in July, higher capacity utilization, and significant reduction in operating losses from both its China and European subsidiaries.
Year-to-date, the group recorded revenue of $182.9 million, an increase of 17.6% year-over-year.
Year-to-date net profit was $18.2 million, a 10.4% increase year-over-year.
John Chia, group managing director said, “Unisem expects the group’s revenue and earnings to improve further … the business of the group will remain strong in the fourth quarter.”
Sequentially, sales were up 89%, while net profit increased 12%.
The significant upsurge in revenue was attributed to increased sales volume, revenue and profit contribution from Unisem Mauritius (formerly known as Advanced Interconnect Technologies Ltd.) after the acquisition in July, higher capacity utilization, and significant reduction in operating losses from both its China and European subsidiaries.
Year-to-date, the group recorded revenue of $182.9 million, an increase of 17.6% year-over-year.
Year-to-date net profit was $18.2 million, a 10.4% increase year-over-year.
John Chia, group managing director said, “Unisem expects the group’s revenue and earnings to improve further … the business of the group will remain strong in the fourth quarter.”
DALLAS – Titan Global Holdings will acquire the assets of EMS provider Nexus Nano Electronics in an equity-based transaction conducted through a third-party investment group.
HERNDON, VA – The International Electronics Manufacturing Initiative announced publication of Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing.
The book, published by Wiley-IEEE Press, is based on results of iNEMI’s six years of study into lead-free electronics, and covers implementation issues of Pb-free solder into board assembly, iNEMI says.
“The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. "Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.”
The book features chapters by industry experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, and tin whisker mitigation strategies.
The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html.
The book, published by Wiley-IEEE Press, is based on results of iNEMI’s six years of study into lead-free electronics, and covers implementation issues of Pb-free solder into board assembly, iNEMI says.
“The iNEMI book is the first practical, primary reference to cover lead-free solder assembly, as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. "Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.”
The book features chapters by industry experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, and tin whisker mitigation strategies.
The 472-page book sells for $99.95 and can be purchased through the Wiley-IEEE Press website at http://www.wiley.com/WileyCDA/WileyTitle/productCd-0471448877,miniSiteCd-IEEE2.html.
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