MILPITAS, CA – Global semiconductor equipment billings contracted 11% year-over-year to $25.6 billion in the third quarter, while quarter-over-quarter billings slipped 1% during the same period, SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
NEEDHAM, MA – Worldwide smartphone shipments are forecast to see 7.3% year-over-year growth in the fourth quarter, according to IDC's Worldwide Quarterly Mobile Phone Tracker.
MORGAN HILL, CA – The World Semiconductor Trade Statistics organization has revised its 2023 forecast for the global semiconductor market, anticipating a single-digit contraction of 9.4% for the year, followed by a robust recovery in 2024 with an estimated growth of 13.1%.
PENANG, MALAYSIA – Escatec's board of directors has appointed Charles-Alexandre Albin chief executive officer, effective March 31, 2024.
WALTHAM, MA – Nano Dimension reported revenue of $12.2 million in the third quarter, up 22% compared to the same quarter in 2022.
NASHVILLE, TN – LFM Capital has announced an investment in SisTech Manufacturing, a printed circuit board assemblies manufacturer for defense, aerospace, industrial and consumer applications.
CHENNAI, INDIA – Syrma SGS Technology has formed a semiconductor-focused subsidiary, named Syrma Semicon, according to a filing with the Bombay Stock Exchange.
TAIPEI – Foxconn will invest more than $1.5 billion in an Indian construction project to fulfill its “operational needs,” the company announced in Taiwanese security filings.
KUALA LUMPUR – Inari Amertron reported revenue of RM383.9 million ($82 million) for the first quarter of its fiscal year, up 1.8% from the RM377 million ($80.5 million) in revenue for the same quarter last year.
BANNOCKBURN, IL – Total North American PCB shipments in October were up 3.9% compared to the same month last year, according to IPC's findings from its North American PCB Statistical Program. The book-to-bill ratio stands at 0.97.
BANNOCKBURN, IL – Total North American EMS shipments in October were down 7.4% compared to the same month last year, according to IPC's findings from its North American EMS Statistical Program. The book-to-bill ratio stands at 1.23.
MORRISVILLE, NC – iNEMI's next webinar in its Packaging Tech Topic Series, set for Nov. 28, is titled LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design and will feature Zuken's Kazunari Koga.