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BERLIN – Germany’s Federal Ministry for Education and Research has announced a 4-year, €400 million research framework for microelectronics.

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LONDON – The global chip on board LED market is expected to exceed $9 billion by 2020, growing at a CAGR of over 35%, according to Technavio analysts.

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WILSONVILLE, OR — Saying there is an urgent industry need for a printed circuit board assembly-specific Internet of Manufacturing standard interface, Mentor Graphics today announced the launch of the Open Manufacturing Language initiative. 

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TAIPEI – Foxconn Electronics reported consolidated revenues of $10.1 billion for January, down 14.8% year-over-year and 17.6% sequentially.

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TORSVIK, SWEDEN – Electronics manufacturer Kitron plans to relocate its Swedish operations to Torsvik, near its current facility in Jonkoping.

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NEWARK, NY — IEC Electronics reported fiscal first quarter net sales rose 14.2% to $32.9 million as the firm's new management's policies are taking hold. 

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FRAMINGHAM, MA – Worldwide personal and entry-level storage (PELS) shipments totaled 68.5 million units in 2015, down 9.2% year-over-year, according to the International Data Corporation.

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ARLINGTON, VA – JEDEC Solid State Technology Association published a revised standard that establishes requirements for the next generation of semiconductor device package components: JESD30G.  

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LITTLETON, MA – VJ Electronix and Apollo Seiko together have developed printed circuit board preheat to enhance the performance of robotic soldering.

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BILLINGSTAD, NORWAY – Kitron reported fourth quarter revenue of NOK 525 million ($61.3 million), an increase of 10.3% year-over-year.

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TABY, SWEDEN – Mycronic has acquired 75% of RoyoTech Digitalelektronik and has an option to acquire the remaining 25%. At the same time Mycronic has acquired 100% of Kognitec Vertrieb and Service. Both companies are based in Höhenkirchen, Germany.

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INDIANAPOLIS – ACE Component Services Group and Divisys International will co-host a solderability testing and component lead tinning workshop here Mar. 8.

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