AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

PORTLAND, OR – The 2016 Medical Electronics Symposium will be held Sept. 14-15 at Marylhurst University.

GARBSEN, GERMANY -- A new study from LPKF shows effects of changes in individual process parameters on stencil manufacturing.

SURREY, UK -- High-performance data center or hyper data center networks that require high-performance switches will drive significantly faster speeds, with the vast majority topping 100GbE by 2019, according to new research.

LAGUNA, PHILIPPINES -- Ionics EMS Inc. has named veteran tech executive and former government leader Jay Sabido president and chief operating officer.

REDMOND, WA – Data I/O today announced a standstill and voting agreement which could limit voting by a leading shareholder.

GOLDEN, CO -- Photo Stencil on July 12 filed for Chapter 11 bankruptcy protection, claiming net debt of more than $7 million spread across more than 200 creditors.

IRVINE, CA – Avnet named William Amelio interim CEO, replacing Rick Hamada, who is stepping down.

NORTHVALE, NJ – ADM Tronics Unlimited reported revenues for the fiscal year ended Mar. 31 were $4.5 million, up 58% year-over-year.

TABY, SWEDEN – Mycronic reported second quarter 2016 net sales of SEK 463 million ($54.6 million), up 62.5% year-over-year. EBIT for the quarter was SEK 106 million, compared to SEK 1 million in the same period last year.

BILLINGSTAD, NORWAY -- Kitron today reported second-quarter revenue rose 15% year-over-year to NOK 563 million ($67 million).

SAN FRANCISCO — Worldwide semiconductor equipment sales will be essentially flat this year before rebounding in 2017 according to SEMI's mid-year forecast.