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TIANJIN, CHINA – Bohai Electronics Week 2008 will open its doors Nov. 10 - 12 at the Tianjin International Exhibition Center.
 
Some 5000 attendees are expected to visit more than 100 vendors from Hong Kong, Japan, Korea, Singapore, Taiwan and North America. Companies exhibiting include A&P, Autoveyor, Ellsworth, Evest, Mirae, MIRTEC, Musashi, Nihon Superior, Panasonic, Shimadzu, Toshiba, Tronic and more.
 
The trade show features products and services from components and assembly technology to quality control and subcontracting services and is sponsored by Reed Exhibitions China.
 
The event will include a live demonstration of a full SMT line, and SMTA China North Conference 2008 will be held in conjunction with BEW. Key topics will include 01005 assembly, 3-D SiP, challenges of PCB fabrication and surface finishes, flex circuit assembly, and manufacturing engineering.
 
For more information, visit www.nepconchina.com.
 
 
EL PASO, TX – Krayden Inc., a distributor of engineered polymer solution materials, will offer Pb-free solders and free board protection seminars with Dow Corning at Mexitronica.
 
Mexitronica will be held in Guadalajara Oct. 21-23.

Krayden’s seminars also can be done at customers’ facilities.
BEAVERTON, ORA-Laser, a provider of laser-cutting services, has expanded its hours of operations to meet demands of just-in-time manufacturers.
 
The firm is now running three shifts to enable 24-hr. capacity.
 
Increased demand has resulted from shrinking profiles and strict tolerance requirements of most electronics and medical components, A-Laser says.
 
A-Laser is a division of FCT Assembly.
 
TAIPEI – The China Economic News Service is reporting Foxconn is considering layoffs of up to 10 to 15% of its staff by year-end.
Read more ...
ERIE, PA – Contract manufacturer Sunburst Electronics is in the final stages of gaining ISO 13485 certification: a quality management standard for medical device manufacturing.

The company plans to extend its medical device industry reach as a result.

Through ISO 13485 certification, Sunburst will incorporate specific quality standards for risk management, meeting customer and regulatory requirements, and process management for medical device manufacturing.

Certification is pending by early 2009.
NATICK, MA – Cognex is offering traceability solutions seminars this fall. The seminars will discuss part traceability solutions for factory automation and how this can increase throughput; lower cost within the manufacturing domain; increase value add, and lower support/service costs in supply chain. 
 
Seminar locations include Portland; Indianapolis; Rolling Meadows, IL; Temecula, CA; Seattle; Dearborn, MI; Atlanta; Hunt Valley, MD; Ft. Lauderdale, FL; Montreal; Norwood, MA; Greenville, SC; Toronto; Toledo, OH; and Grand Rapids, MI.
 
CHANGZHOU, CHINA – Microtek (Changzhou) Laboratories has been authorized by China Quality Certification Center to test PCBs, copper-clad laminates and plastics, the company said today.
 
The lab, which is headquartered in the US, is now able to issue CQC certification (CQC-V084) for the domestic Chinese market.
 
It reportedly marks the first time CQC has authorized a foreign-based laboratory to perform testing to these categories.
  
CQC covers 31 test methods and is based on China National (GB) Standards, as well as certain IEC and ISO standards.
 
CQC is often specified by various Chinese governmental departments that require product safety certifications.   
 
 
CHANDLER, AZIsola USA Corp. filed a complaint with the US International Trade Commission claiming certain imports of prepregs, laminates and PCBs infringe claims of its patents.
 
In the complaint, the Chandler-based company alleged several Asia companies, among them Ventec Electronics, Taiwan Union Technology, ITEQ Corp., and Guangdong Shengyi Sci. Tech Co., of violating Section 337 of the Tariff Act of 1930.
 
The company is asking the US ITC to ban the imports of any materials or products that allegedly infringe Isola's patents, including Ventec's VT-47 and VT-48, TUC's TU-662 and TU-752, ITEQ's IT-200DK, and Guangdong Shengyi's S1000.
 
Last week, Isola asked the China courts for help in protecting its IP, naming TUC and ITEQ for patent infringements. TUC strongly denied the allegations, insisting Isola “stop harassing TUC customers and interested companies at once.” ITEQ did not publicly respond. 
 
CORINTH, MI -- ACT Electronics's electronics manufacturing services plant here will begin laying off workers as early as Dec. 4, according to published reports. About two weeks ago, the company told customers it would close its Hudson, MA, factories.
Read more ...
ITASCA, IL – ITW lowered its third quarter and full-year forecasts following a slowdown in North America as industrial production and end-market fundamentals weakened and margins tightened last month, the company said.

Read more ...
SMYRNA, GA – Registration for Virtual PCB is now open. Virtual PCB, sponsored by UP Media Group, is the industry's first virtual tradeshow for the PCB design, fabrication and assembly industry.
 
The online event will take place Nov. 12 – 13.
 
The free, two-day show can be accessed from anywhere in the world via a computer.
 
Virtual PCB provides on-demand educational presentations; private communications with exhibitors and other attendees; worldwide access to exhibitor booths and sessions; downloadable literature and product brochures; white papers; live, scheduled group chats with industry experts; live group chats with peers, and auditorium content. 
 
For more information, visit www.virtual-pcb.com. To register, visit http://vshow.on24.com/clients/vshow/upmedia/register.htm.
 
SAN JOSEFreescale Semiconductors director of packaging technology Glenn Daves will keynote an upcoming MEPTEC symposium on packaging.
 
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
 
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
 
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
 
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
 
To register, visit www.meptec.org.
 
 

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